MMSTA55/MMSTA56

PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR

Features

•

Epitaxial Planar Die Construction

•

Complementary NPN Type Available

(MMSTA05/MMSTA06)

•

Ideal for Low Power Amplification and Switching

•

Ultra-Small Surface Mount Package

•

Lead Free/RoHS Compliant (Note 2)

•

"Green" Device (Note 3 and 4)

Mechanical Data

•

Case: SOT-323

•

Case Material: Molded Plastic, "Green" Molding

Compound, Note 4. UL Flammability Classification

Rating 94V-0

•

Moisture Sensitivity: Level 1 per J-STD-020C

•

Terminal Connections: See Diagram

•

Terminals: Solderable per MIL-STD-202, Method 208

•

Lead Free Plating (Matte Tin Finish annealed over

Alloy 42 leadframe).

•

MMSTA55 Marking K2H, K2G (See Page 3)

•

MMSTA56 Marking K2G (See Page 3)

•

Ordering & Date Code Information: See Page 3

•

Weight: 0.006 grams (approximate)

SOT-323

Dim

Min

Max

A

0.25

0.40

B

1.15

1.35

C

2.00

2.20

D

0.65 Nominal

E

0.30

0.40

G

1.20

1.40

H

1.80

2.20

J

0.0

0.10

K

0.90

1.00

L

0.25

0.40

M

0.10

0.18

α

0

°

8

°

All Dimensions in mm

E

B

C

A

M

J

L

E

D

B C

H

K

G

BE

C

Characteristic

Symbol

MMSTA55

MMSTA56

Unit

Collector-Base Voltage

-60

-80

V

Collector-Emitter Voltage

-60

-80

V

Emitter-Base Voltage

-4.0

V

Collector Current - Continuous (Note 1)

-500

mA

Power Dissipation (Note 1)

200

mW

Thermal Resistance, Junction to Ambient (Note 1)

625

°C/W

Operating and Storage Temperature Range

-55 to +150

°C

Notes:

1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which

can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.

2. No purposefully added lead.

3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

4. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date

Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.

DS30167 Rev. 10 - 2

1 of 3

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MMSTA55/MMSTA56

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