NPN PRE-BIASED 100 mA SURFACE MOUNT TRANSISTOR

Features

DS30404 Rev. 6 - 2

1 of 3

www.diodes.com

DDTC (LO-R1) E

© Diodes Incorporated

•

Epitaxial Planar Die Construction

•

Complementary PNP Types Available (DDTA)

•

Built-In Biasing Resistors

•

Lead Free/RoHS Compliant (Note 2)

•

"Green" Device (Note 3 and 4)

Mechanical Data

•

Case: SOT-523

•

Case Material: Molded Plastic. UL Flammability

Classification Rating 94V-0

•

Moisture Sensitivity: Level 1 per J-STD-020C

•

Terminals: Finish - Solderable per MIL-STD-202,

Method 208

•

Lead Free Plating (Matte Tin Finish annealed over Alloy

42 leadframe)

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Terminal Connections: See Diagram

•

Marking Information: See Table Below & Page 3

•

Ordering Information: See Page 3

•

Weight: 0.002 grams (approximate)

P/N

R1 (NOM)

R2 (NOM) MARKING

DDTC122LE

DDTC142JE

DDTC122TE

DDTC142TE

0.22K

Ω

0.47K

Ω

0.22K

Ω

0.47K

Ω

10K

Ω

10K

Ω

OPEN

OPEN

N81

N82

N83

N84

SOT-523

A

M

J

L

D

Dim

Min

Max

Typ

A

0.15

0.30

0.22

B

0.75

0.85

0.80

C

1.45

1.75

1.60

D

⎯

⎯

0.50

G

0.90

1.10

1.00

H

1.50

1.70

1.60

J

0.00

0.10

0.05

K

0.60

0.80

0.75

L

0.10

0.30

0.22

M

0.10

0.20

0.12

N

0.45

0.65

0.50

α

0

°

8

°

⎯

All Dimensions in mm

Characteristic

Symbol

Value

Unit

Supply Voltage, (3) to (2)

50

V

Input Voltage, (1) to (2)

DDTC122LE

DDTC142JE

-5 to +6

-5 to +6

V

Input Voltage, (2) to (1)

DDTC122TE

DDTC142TE

5

V

Output Current

All

100

mA

Power Dissipation

(Note 1)

150

mW

Thermal Resistance, Junction to Ambient Air

(Note 1)

625

°C/W

Operating and Storage Temperature Range

-55 to +150

°C

Note:

1. Mounted on FR4 PC Board with recommended pad layout at http://www.diodes.com/datasheets/ap02001.pdf.

2. No purposefully added lead.

3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date

Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.

Schematic and Pin Diagram

R1

OUT

B

C

E

R2

3

2

1

IN

GND(0)

B C

H

K

G

N

TOP VIEW