DDC (LO-R1) H

NPN PRE-BIASED SMALL SIGNAL DUAL SURFACE MOUNT TRANSISTOR

Features

•

Epitaxial Planar Die Construction

•

Complementary PNP Types Available (DDA)

•

Built-In Biasing Resistors

•

Lead Free By Design/RoHS Compliant (Note 3)

•

"Green" Device (Note 4 and 5)

Mechanical Data

DS30428 Rev. 4 - 2

1 of 3

www.diodes.com

DDC (LO-R1) H

© Diodes Incorporated

•

Case: SOT-563, Molded Plastic

•

Case Material: Molded Plastic. UL Flammability

Classification Rating 94V-0

•

Moisture Sensitivity: Level 1 per J-STD-020C

•

Terminals: Finish - Matte Tin annealed over Alloy 42

leadframe. Solderable per MIL-STD-202, Method 208

•

Terminal Connections: See Diagram

•

Weight: 0.005 grams (approximate)

P/N

R1 (NOM)

R2 (NOM) MARKING

DDC122LH

DDC142JH

DDC122TH

DDC142TH

0.22K

Ω

0.47K

Ω

0.22K

Ω

0.47K

Ω

10K

Ω

10K

Ω

OPEN

OPEN

N81

N82

N83

N84

SOT-563

Dim

Min

Max

Typ

A

0.15

0.30

0.25

B

1.10

1.25

1.20

C

1.55

1.70

1.60

D

0.50

G

0.90

1.10

1.00

H

1.50

1.70

1.60

K

0.56

0.60

0.60

L

0.15

0.25

0.20

M

0.10

0.18

0.11

All Dimensions in mm

A

M

L

Maximum Ratings

Characteristic

Symbol

Value

Unit

Supply Voltage (6) to (1) and (3) to (4)

50

V

Input Voltage (2) to (1) and (5) to (4)

DDC122LH

DDC142JH

-5 to +6

-5 to +6

V

Input Voltage (1) to (2) and (4) to (5)

DDC122TH

DDC142TH

5

V

Output Current

All

100

mA

Power Dissipation

150

mW

Thermal Resistance, Junction to Ambient Air

(Note 2)

833

°C/W

Notes:

1. Package is non-polarized. Parts may be on reel in orientation illustrated, 180° rotated, or mixed (both ways).

2. Mounted on FR4 Board with recommended pad layout at http://www.diodes.com/datasheets/ap02001.pdf.

3. No purposefully added lead.

4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date

Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants

SCHEMATIC DIAGRAM, TOP VIEW

6

54

3

2

1

65

4

3

2

1

B C

H

K

G

D

NXXYM

SEE NOTE 1