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DMN3112S Datasheet(PDF) 1 Page - Diodes Incorporated

Part # DMN3112S
Description  N-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR
PDF  4 Pages
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

DMN3112S Datasheet(HTML) 1 Page - Diodes Incorporated

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DMN3112S
Document number: DS31445 Rev. 2 - 2
1 of 4
www.diodes.com
July 2008
© Diodes Incorporated
DMN3112S
N-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR
Features
•
Low On-Resistance:
57m
Ω @ VGS = 10V
112m
Ω @ VGS = 4.5V
•
Low Gate Threshold Voltage
•
Low Input Capacitance
•
Fast Switching Speed
•
Low Input/Output Leakage
•
Lead Free By Design/RoHS Compliant (Note 2)
•
"Green" Device (Note 3)
•
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
•
Case: SOT-23
•
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
•
Moisture Sensitivity: Level 1 per J-STD-020D
•
Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
•
Terminal Connections: See Diagram
•
Marking Information: See Page 4
•
Ordering Information: See Page 4
•
Weight: 0.008 grams (approximate)
Maximum Ratings @TA = 25°C unless otherwise specified
SOT-23
TOP VIEW
Source
Gate
Drain
Equivalent Circuit
D
G
S
TOP VIEW
Characteristic
Symbol
Value
Unit
Drain Source Voltage
VDSS
30
V
Gate-Source Voltage
VGSS
±20
V
Drain Current (Note 1)
TA = 25°C
TA = 70°C
ID
5.8
4.2
A
Drain Current (Note 1)
Pulsed
IDM
20
A
Body-Diode Continuous Current (Note 1)
IS
2.0
A
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Total Power Dissipation (Note 1)
PD
1.4
W
Thermal Resistance, Junction to Ambient @TA = 25°C (Note 1)
RθJA
90
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-55 to +150
°C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 4)
Drain-Source Breakdown Voltage
BVDSS
30
⎯
⎯
V
VGS = 0V, ID = 250μA
Zero Gate Voltage Drain Current
IDSS
⎯
⎯
800
nA
VDS = 30V, VGS = 0V
Gate-Body Leakage
IGSS
⎯
⎯
±80
±800
nA
VGS = ±20V, VDS = 0V
VGS = ±25V, VDS = 0V
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
VGS(th)
1.3
1.9
2.2
V
VDS = VGS, ID = 250μA
Static Drain-Source On-Resistance
RDS (ON)
⎯
⎯
47
92
57
112
m
Ω
VGS = 10V, ID = 5.8A
VGS = 4.5V, ID = 4.2A
Forward Transconductance
|Yfs|
⎯
4.7
⎯
S
VDS = 5V, ID = 4.2A
Source-Drain Diode Forward Voltage
VSD
⎯
0.78
1.1
V
VGS = 0V, IS = 2.0A
DYNAMIC CHARACTERISTICS
Input Capacitance
Ciss
⎯
268
⎯
pF
Output Capacitance
Coss
⎯
73
⎯
pF
Reverse Transfer Capacitance
Crss
⎯
50
⎯
pF
VDS = 5V, VGS = 0V
f = 1.0MHz
Notes:
1. Device mounted on FR-4 PCB. t
≤5 sec.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Short duration pulse test used to minimize self-heating effect.
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