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MIC5271 Datasheet(PDF) 3 Page - Micrel Semiconductor |
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MIC5271 Datasheet(HTML) 3 Page - Micrel Semiconductor |
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3 / 10 page ![]() October 2003 3 MIC5271 MIC5271 Micrel Absolute Maximum Ratings (Note 1) Input Voltage (V –IN) ...................................... –20V to +0.3V Enable Voltage (V EN) .................................... –20V to +20V Power Dissipation (P D) ............................ Internally Limited Junction Temperature (T J) ....................... –40°C to +125°C Lead Temperature (soldering, 5 sec.) ....................... 260°C Storage Temperature (T S) ....................... –65°C to +150°C ESD Rating, Note 3 Operating Ratings (Note 2) Input Voltage (V IN) ....................................... –16V to –3.3V Enable Voltage (V EN) .................................... –16V to +16V Junction Temperature (T J) ....................... –40°C to +125°C Thermal Resistance (θJA) Note 4 ......................... 235°C/W Electrical Characteristics (Note 5) V IN = VOUT – 1.0V; COUT = 4.7µF, IOUT = 100µA; TJ = 25°C, bold values indicate –40°C ≤ TJ ≤ +125°C; unless noted. Symbol Parameter Condition Min Typ Max Units V OUT Output Voltage Accuracy Variation from nominal V OUT –2 2 % –3 3 % ∆VOUT/∆T Output Voltage Temperature Note 6 100 ppm/°C Coefficient ∆VOUT/VOUT Line Regulation V IN = VOUT – 1V to –16V 0.04 0.15 %/V 0.2 ∆VOUT/VOUT Load Regulation I OUT = 100µA to 100mA, Note 7 0.4 1.8 % 2.0 % V IN – VOUT Dropout Voltage, Note 8 I OUT = 100µA55 mV I OUT = 50mA 360 500 mV I OUT = 100mA 500 700 mV 900 I GND Ground Current, Note 9 I OUT = 100µA25 100 µA I OUT = 50mA 0.9 mA I OUT = 100mA 2.0 3.0 mA I GND_SD Ground current in shutdown V EN = ±0.6V –1.0 0.1 +1.0 µA PSRR Ripple Rejection f = 120Hz 50 dB I LIMIT Current Limit V OUT = 0V 235 350 mA Enable Input T ON Turn-on Time Time to V OUT = 90% nom. 60 µs V EN Input Low voltage Regulator OFF ±0.6 V Input High Voltage Regulator ON ±2.0 V I EN Enable Input Current V EN = ± 0.6V and –2.0V 0.1 µA V EN = +2.0V 5.6 10.0 Note 1. Exceeding the absolute maximum rating may damage the device. Note 2. The device is not guaranteed to function outside its operating rating. Note 3. Devices are ESD sensitive. Handling precautions recommended. Note 4. The maximum allowable power dissipation is a function of the maximum junction temperature, T J(max), the junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using: P D(max) = (TJ(max) –TA) / θJA, where θJA is 235°C/W. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. See the “Thermal Considerations” section for details. Note 5. Specification for packaged product only. Note 6. Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range. Note 7. Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range from 100µA to 100mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Note 8. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at 1V differential. Note 9. Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of the load current plus the ground pin current. |
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