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ZXMP3F30FH Datasheet(PDF) 4 Page - Diodes Incorporated

Part # ZXMP3F30FH
Description  30V SOT23 P-CHANNEL ENHANCEMENT MODE MOSFET
PDF  8 Pages
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

ZXMP3F30FH Datasheet(HTML) 4 Page - Diodes Incorporated

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ZXMP3F30FH
Electrical characteristics (at Tamb = 25°C unless otherwise stated)
Parameter
Symb
ol
Min.
Typ.
Max.
Unit Conditions
Static
Drain-Source breakdown
voltage
V(BR)DSS
-30
V
ID = -250μA, VGS=0V
Zero Gate voltage Drain
current
IDSS
-1.0
µA
VDS=-30V, VGS=0V
Gate-Body leakage
IGSS
100
nA
VGS20V, VDS=0V
Gate-Source threshold
voltage
VGS(th)
-1.0
V
ID= -250μA, VDS=VGS
Static Drain-Source
on-state resistance
(*)
RDS(on)
0.080
0.140
VGS= -10V, ID= -2.5A
VGS= -4.5V, ID= -1.9A
Forward
Transconductance
(*) (†)
gfs
5
S
VDS= -15V, ID= -3A
Dynamic
(†)
Input capacitance
Ciss
370
pF
Output capacitance
Coss
72
pF
Reverse transfer
capacitance
Crss
38
pF
VDS= -15V, VGS=0V
f=1MHz
Switching
(‡) (†)
Turn-on-delay time
td(on)
1.3
ns
Rise time
tr
2.6
ns
Turn-off delay time
td(off)
49
ns
Fall time
tf
22
ns
VDD= -15V, VGS= -10V
ID= -1A
RG ≅ 6.0Ω,
Gate charge
Total Gate charge
Qg
7
nC
Gate-Source charge
Qgs
1.2
nC
Gate-Drain charge
Qgd
1.3
nC
VDS= -15V, VGS= -10V
ID= -3A
Source–Drain diode
Diode forward voltage
(*)
VSD
-0.80
-1.2
V
IS= -1.7A,VGS=0V
Reverse recovery time
(‡)
trr
14.6
ns
Reverse recovery charge
(‡)
Qrr
9.5
nC
IS= -1.5A,di/dt=100A/μs
NOTES:
(*) Measured under pulsed conditions. Pulse width
≤ 300μs; duty cycle ≤ 2%.
(†)Switching characteristics are independent of operating junction temperature.
(‡)For design aid only, not subject to production testing
Issue 1 - August 2008
4
© Diodes Incorporated
www.zetex.com
www.diodes.com



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