ZXTP2009Z

SEMICO NDUC TORS

ISSUE 1 - JUNE 2005

2

PARAMETER

SYMBOL

VALUE

UNIT

Junction to ambient

(a)

139

°C/W

Junction to ambient

(b)

83

°C/W

Junction to ambient

(c)

60

°C/W

Junction to ambient

(d)

42

°C/W

NOTES

(a) For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.

(b) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.

(c) For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.

(d) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB measured at t

5 secs.

THERMAL RESISTANCE

PARAMETER

SYMBOL

LIMIT

UNIT

Collector-base voltage

-50

V

Collector-base voltage

-50

V

Collector-emitter voltage

-40

V

Emitter-base voltage

-7.5

V

Continuous collector current

(b)

-5.5

A

Peak pulse current

-15

A

(a)

Linear derating factor

0.9

7.2

W

mW/°C

(b)

Linear derating factor

1.5

12

W

mW/°C

(c)

Linear derating factor

2.1

16.8

W

mW/°C

(d)

Linear derating factor

3

24

W

mW/°C

Operating and storage temperature range

-55 to 150

°C

ABSOLUTE MAXIMUM RATINGS