CP764X datasheet(1/2 Pages) CENTRAL

Part #	CP764X

Description	Small Signal MOSFET Transistor P-Channel Enhancement-Mode Transistor Chip

PDF	2 Pages

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Manufacturer	CENTRAL [Central Semiconductor Corp]

Direct Link	http://www.centralsemi.com

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1 / 2 page

GEOMETRY

PROCESS DETAILS

PRINCIPAL DEVICE TYPES

CMLDM8002A

CMPDM8002A

CTLDM8002A-M621

GROSS DIE PER 6 INCH WAFER

62,600

PROCESS CP764X

Small Signal MOSFET Transistor

P-Channel Enhancement-Mode Transistor Chip

Process

EPITAXIAL PLANAR

Die Size

21.7 x 17.7 MILS

Die Thickness

5.5 MILS

Gate Bonding Pad Area

4.7 x 4.7 MILS

Source Bonding Pad Area

6.1 x 7.9 MILS

Top Side Metalization

Al-Si - 35,000Å

Back Side Metalization

Au - 12,000Å

www.centr a lsemi.com

R1 (22-March 2010)

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