CPD73_10 datasheet(1/2 Pages) CENTRAL

Part #	CPD73

Description	Bridge Rectifier Monolithic Quad Diode Bridge Chip

PDF	2 Pages

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Manufacturer	CENTRAL [Central Semiconductor Corp]

Direct Link	http://www.centralsemi.com

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GEOMETRY

PROCESS DETAILS

PRINCIPAL DEVICE TYPES

CMFBR-6F

GROSS DIE PER 3 INCH WAFER

10,000

PROCESS CPD73

Bridge Rectifier

Monolithic Quad Diode Bridge Chip

Die Size

25 x 25 MILS

Die Thickness

6.0 MILS

Bonding Pad Area 1 (+DC)

3.0 x 3.0 MILS

Bonding Pad Area 2 (AC)

3.0 x 7.0 MILS

Bonding Pad Area 3 (-DC)

3.0 x 4.0 MILS

Bonding Pad Area 4 (AC)

3.0 x 7.0 MILS

Top Side Metalization

Al - 12,000Å

Back Side Metalization

Au - 5,000Å

www.centr a lsemi.com

R2 (22-March 2010)

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