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MIC94092 Datasheet(PDF) 13 Page - Micrel Semiconductor

Part # MIC94092
Description  High Side Load Switches for Consumer Applications
PDF  16 Pages
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Manufacturer  MICREL [Micrel Semiconductor]
Direct Link  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

MIC94092 Datasheet(HTML) 13 Page - Micrel Semiconductor

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Micrel, Inc.
MIC94090/1/2/3/4/5
March 2009
13
M9999-033109-A
Application Information
Power Dissipation Considerations
As with all power switches, the ultimate current rating of
the switch is limited by the thermal properties of the
package and the PCB it is mounted on. There is a
simple, ohms law type relationship between thermal
resistance, power dissipation and temperature which are
analogous to an electrical circuit:
Figure 1. Electrical Circuit
From this simple circuit we can calculate Vx if we know
Isource, Vz and the resistor values, Rxy and Ryz using
the equation:
() Vz
Ryz
Rxy
Isource
Vx
+
+
⋅
=
Thermal circuits can be considered using these same
rules and can be drawn similarly replacing current
sources with Power dissipation (in Watts), Resistance
with Thermal Resistance (in
oC/W) and Voltage sources
with temperature (in
oC).
Figure 2. Thermal Equivalent Circuit
Now replacing the variables in the equation for Vx, we
can find the junction temperature (Tj) from power
dissipation, ambient temperature and the known thermal
resistance of the PCB (R
θ
CA) and the package (RθJA).
()
AMB
CA
JC
DISS
J
T
R
R
P
T
+
+
⋅
=
θ
θ
(1)
It is this equation that is used to determine the graphs on
page 7. PDISS is calculated as (ISWITCH
2 x R
SWmax). RθJC is
found in the operating ratings section of the datasheet
and R
θ
CA
(the PCB thermal resistance) values for
various PCB copper areas can be taken from ‘Designing
with Low Dropout Voltage Regulators’
(1) available from
the Micrel website (LDO Application Hints).
Example:
A switch is intended to drive a 500mA load and is placed
on a printed circuit board which has a ground plane area
of at least 25mm square. The Voltage source is a Li-ion
battery with a lower operating threshold of 3V and the
ambient temperature of the assembly can be up to 50
oC.
Summary of variables:
ISW = 0.5A
VIN = 3V to 4.2V
Tamb = 50
oC
R
θ
JC = 60
oC/W from Datasheet (P. 3)
R
θ
CA = 53
oC/W Read from Graph in Fig. 3
Figure 3. Excerpt from the LDO Book
(1)
PDISS = ISW
2 x R
SWmax
The worst case switch resistance (RSWmax) at the lowest
VIN of 3V is not available in the datasheet, so the next
lower value of VIN is used.
RSWmax @ 2.5v = 315mΩ
If this were a figure for worst case RSWmax for 25
oC, an
additional consideration is to allow for the maximum
junction temperature of 125
oC, the actual worst case
resistance in this case will be 30% higher (See RDS(on)
variance vs. temperature graph).
RSWmax @ 2.5v (@ 125’C) = 315 x 1.3 = 410mΩ
Therefore junction temperature (TJ):
TJ = 0.5
2 x 0.41 x (60+53) + 50
from (Eqn. 1)
TJ = 62
oC
This is well below the maximum 125
oC.



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