1

RoHS Compliant

Rev. V4

MA4SPS302

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383

• China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Features

 Surface Mount

 No Wire Bonding Required

 Rugged Silicon-Glass Construction

 Silicon Nitride Passivation

 Polymer Scratch Protection

 Low Parasitic Capacitance and Inductance

 High Average and Peak Power Handling

 RoHS Compliant

Description

This device is a Silicon-Glass PIN diode chip

fabricated with M/A-COM Tech’s patented HMIC

TM

process. This device features two silicon pedestals

embedded in a low loss, low dispersion glass. The

diode is formed on the top of one pedestal and

connections to the backside of the device are

facilitated

by

making

the

pedestal

sidewalls

electrically

conductive.

Selective

backside

metallization is applied producing a surface mount

device. This vertical conic topology provides for

exceptional heat transfer from the active area. The

topside is fully encapsulated with silicon nitride and

has an additional polymer layer for scratch and

impact protection. These protective coatings prevent

damage to the junction and the anode air-bridge

during handling and assembly.

Parameter

Absolute Maximum

Forward Current

600mA

Reverse Voltage

| -100V |

Operating Temperature

-55°C to +125°C

Storage Temperature

-55 °C to +150°C

Junction Temperature

+175°C

Dissipated Power

( RF & DC )

800mW

Mounting Temperature

+260°C for 30 seconds

Absolute Maximum Ratings

MA4SPS302

1. Backside metal: 0.1 µM thick.

2. Yellow hatched areas indicate backside ohmic gold

DIM

INCHES

MM

Min.

Max.

Min.

Max.

A

0.052

0.056

1.321

1.422

B

0.020

0.024

0.508

0.610

C

0.004

0.006

0.102

0.152

D

0.018

0.020

0.457

0.508

E

0.014

0.016

0.356

0.406