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IXFR10N100Q Datasheet(PDF) 1 Page - IXYS Corporation |
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IXFR10N100Q Datasheet(HTML) 1 Page - IXYS Corporation |
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1 / 2 page ![]() © 2002 IXYS All rights reserved Symbol Test Conditions Maximum Ratings V DSS T J = 25 °C to 150°C 1000 V V DGR T J = 25 °C to 150°C; R GS = 1 MΩ 1000 V V GS Continuous ±20 V V GSM Transient ±30 V I D25 T C = 25 °C 12N100 10 A 10N100 9 A I DM T C = 25 °C, Pulse width limited by T JM 12N100 48 A 10N100 40 A I AR T C = 25 °C 12N100 12 A 10N100 10 A E AR T C = 25 °C30 mJ dv/dt I S ≤ I DM, di/dt ≤ 100 A/µs, VDD ≤ VDSS 5 V/ns T J ≤ 150°C, R G = 2 Ω P D T C = 25 °C 250 W T J -55 ... +150 °C T JM 150 °C T stg -55 ... +150 °C T L 1.6 mm (0.063 in.) from case for 10 s 300 °C V ISOL 50/60 Hz, RMS t = 1 min 2500 V~ Weight 5 g Symbol Test Conditions Characteristic Values (T J = 25°C, unless otherwise specified) min. typ. max. V DSS V GS = 0 V, ID = 3mA 1000 V V GS(th) V DS = VGS, ID = 4mA 2.5 5.5 V I GSS V GS = ±20 VDC, VDS = 0 ±100 nA I DSS V DS = 0.8•VDSS T J = 25 °C50 µA V GS = 0 V T J = 125 °C 1 mA R DS(on) V GS = 10 V, ID = IT 12N100 1.1 Ω Notes 1 & 2 10N100 1.2 Ω DS98589-B (10/02) ISOPLUS 247TM Features ● Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mounting surface - 2500V electrical isolation ● Low drain to tab capacitance(<50pF) ● Low R DS (on) HDMOS TM process ● Rugged polysilicon gate cell structure ● Unclamped Inductive Switching (UIS) rated ● Fast intrinsic Rectifier Applications ● DC-DC converters ● Battery chargers ● Switched-mode and resonant-mode power supplies ● DC choppers ● AC motor control Advantages ● Easy assembly ● Space savings ● High power density G = Gate D = Drain S = Source * Patent pending Isolated back surface* V DSS I D25 R DS(on) IXFR 12N100Q 1000 V 10 A 1.1 Ω Ω Ω Ω Ω IXFR 10N100Q 1000 V 9 A 1.20 Ω Ω Ω Ω Ω t rr ≤ ≤≤≤≤ 300 µµµµµs HiPerFETTM Power MOSFETs ISOPLUS247TM Q CLASS (Electrically Isolated Back Surface) N-Channel Enhancement Mode Avalanche Rated, High dV/dt Low Gate Charge and Capacitances |
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