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TLE4253 Datasheet(PDF) 6 Page - Infineon Technologies AG |
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TLE4253 Datasheet(HTML) 6 Page - Infineon Technologies AG |
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6 / 22 page ![]() TLE4253 General Product Characteristics Data Sheet 6 Rev. 1.2, 2009-11-09 4.2 Functional Range Note: Within the functional range the IC operates as described in the circuit description. The electrical characteristics are specified within the conditions given in the related electrical characteristics table. 4.3 Thermal Resistance Pos. Parameter Symbol Limit Values Unit Conditions Min. Max. 4.2.1 Input Voltage V I 3.5 40 V V I ≥ VQ + Vdr 4.2.1 Adjust / Enable Input Voltage (Voltage Tracking Range) V ADJ/EN 2.0 – V – 4.2.2 Junction Temperature T j -40 150 °C– 4.2.3 Output Capacitor Requirements C Q 10 µF –1) 1) The minimum output capacitance requirement is applicable for a worst case capacitance tolerance of 30%. 4.2.4 ESR CQ –5 Ω –2) 2) relevant ESR value at f = 10 kHz. Pos. Parameter Symbol Limit Value Unit Conditions Min. Typ. Max. PG-DSO-8: 4.3.1 Junction to Soldering Point R thJSP – 39 – K/W Pins 2 - 3 and 6 - 7 fixed to T A 4.3.2 Junction to Ambient R thJA – 150 – K/W Footprint only 1) 1) Package mounted on PCB FR4; 80 x 80 x 1.5 mm; 35 µm Cu, 5 µm Sn; horizontal position; zero airflow. Not subject to production test; specified by design. 4.3.3 – 91 – K/W 300 mm2 PCB heatsink area 1) 4.3.4 – 81 – K/W 600 mm2 PCB heatsink area 1) 4.3.5 – 65 – K/W 2s2p board2) 2) Specified R thJA value is according to JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The product (chip+package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu). Where applicable a thermal via array under the package contacted the first inner copper layer. PG-DSO-8 exposed pad: 4.3.6 Junction to Case Bottom R thJC – 9 – K/W Measured to exposed bottom pad 4.3.7 Junction to Ambient R thJA – 169 – K/W Footprint only 1) 4.3.8 – 64 – K/W 300 mm2 PCB heatsink area 1) 4.3.9 – 55 – K/W 600 mm2 PCB heatsink area 1) 4.3.10 – 49 – K/W 2s2p board2) |
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