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MB205L Datasheet(PDF) 1 Page - SeCoS Halbleitertechnologie GmbH

Part # MB205L
Description  Miniature SMD Glass Passivated Bridge Rectifiers
PDF  2 Pages
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Manufacturer  SECOS [SeCoS Halbleitertechnologie GmbH]
Direct Link  http://www.secosgmbh.com
Logo SECOS - SeCoS Halbleitertechnologie GmbH

MB205L Datasheet(HTML) 1 Page - SeCoS Halbleitertechnologie GmbH

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MB205L
VOLTAGE 600 V
2 Amp
Miniature SMD Glass Passivated Bridge Rectifiers
Elektronische Bauelemente
03-Sep-2010 Rev. A
Page 1 of 2
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
RoHS compliant product
A suffix of “-C” specifies halogen & lead-free
FEATURES
Halogen-free type
Internal structure with GPRC (Glass Passivated Rectifier Chip) inside
Lead free product, compliance to RoHS
Lead less chip form, no lead damage
Lead-free solder joint, no wire bond & lead frame
Low power loss, high efficiency
High current capability
Plastic package has Underwriters Laboratory Flammability
Classification 94V-0
APPLICATION
AC/DC Power Supply
Communication Equipment
MECHANICAL DATA
MARKING
Case : Packed with FRP substrate and epoxy under-filled
Terminals : Pure Tin plated (Lead-Free),
solderable per MIL-STD-750, Method 2026
Polarity: Laser Marking Symbols
Weight: 0.07 grams
ABSOLUTE MAXIMUM RATINGS
(at TA=25℃unless otherwise specified)
PARAMETERS
SYMBOL
RATING
UNIT
Repetitive peak reverse voltage
VRRM
600
V
Average Forward Current
IF(AV)
2.0
A
Peak forward surge current,
8.3ms single half sine-wave
IFSM
60
A
Operating and Storage temperature range
TJ, TSTG
-55 ~ 175
ELECTRICAL CHARACTERISTICS (at TA=25℃unless otherwise specified)
PARAMETERS
SYMBOL
Min.
Typ.
Max.
UNIT
Forward Voltage at IF = 2.0A
VF
-
0.92
0.95
V
Repetitive peak reverse current
VR = Max. VRRM
IRRM
-
0.08
5
uA
Current squared time t < 8.3ms
I
2t
-
14.9
-
A
2s
Junction Capacitance, VR = 4V, f =1.0MHz
CJ
-
35
-
pF
Thermal Resistance Junction to Ambient
1
RθJA
-
60
-
/W
Thermal Resistance Junction to Lead
2
RθJL
-
3
-
Note:
1. Thermal resistance, junction to ambient, measured on PC board with 5.0 x 5.0mm (0.03mm thick) land areas.
2. The thermal resistance in measured over the centered point of the copper pad.
REF.
Millimeter
REF.
Millimeter
Min.
Max.
Min.
Max.
A
5.20
5.40
E
1.00
1.20
B
5.70
5.90
F
0.85
0.95
C
1.10
1.30
G
R 0.2 REF.
D
3.25
3.35
Case: MBCR
~
~
A
B
C
D
E
F
G


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