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S2N7002 Datasheet(PDF) 1 Page - SeCoS Halbleitertechnologie GmbH |
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S2N7002 Datasheet(HTML) 1 Page - SeCoS Halbleitertechnologie GmbH |
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1 / 2 page ![]() Elektronische Bauelemente S2N7002 115 mA, 60 V, R DS(ON) = 7.5 Ω N-Ch Small Signal MOSFET 24-Nov-2009 Rev. B Page 1 of 2 http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually. Top View A L C B D G H J F K E 1 2 3 1 2 3 1 Gate Drain 3 702 W 702 =Device Code W =Date Code 2 Source RoHS Compliant Product A suffix of “-C” specifies halogen & lead-free FEATURES Pb-Free Package is Available PACKAGING INFORMATION MAXIMUM RATINGS (at T A = 25°C unless otherwise specified) PARAMETER SYMBOL RATING UNIT Drain-Source Voltage VDSS 60 Vdc Drain-Gate Voltage(RGS=1.0 M ) VDGR 60 Vdc TC=25°C 1 ±115 mAdc Continuous Drain Current TC=100°C 1 ID ±75 mAdc Pulsed Drain Current 2 IDM ±800 mAdc Continuous Gate-Source Voltage VGS ±20 Vdc Non-Repetitive Gate-Source Voltage(tP 5 ≦ 0 µS) VGSM ±40 Vpk THERMAL CHARACTERISTICS TA=25°C 225 mW Total Device Dissipation FR-5 Board 3 Derate above 25°C PD 1.8 mW/°C Thermal Resistance, Junction to Ambient R θJA 556 °C/W Junction and Storage Temperature TJ, TSTG -55~150 °C Note: 1. The Power Dissipation of the package may result in a lower continuous drain current. 2. Pulse Test: Pulse Width ≦300 µs, Duty Cycle ≦ 2.0% 3. FR-5 = 1.0 x 0.75 x 0.062 in. 4. Alumina = 0.4 x 0.3 x 0.025 in 99.5% alumina ELECTRICAL CHARACTERISTICS (at T A = 25°C unless otherwise specified) PARAMETER SYMBOL MIN. TYP. MAX. UNIT TEST CONDITION OFF CHARACTERISTICS Drain-Source Breakdown Voltage V(BR)DSS 60 - - Vdc VGS = 0, ID = 10 µAdc TJ =25°C - - 1.0 Zero Gate Voltage Drain Current TJ =125°C IDSS - - 500 µAdc V GS=0, VDS = 60Vdc Gate-Body Leakage Current, Forward IGSSF - - 100 nAdc VGS=20Vdc Gate-Body Leakage Current, Reverse IGSSR - - -100 nAdc VGS=-20Vdc ON CHARACTERISTICS 1 Gate Threshold Voltage VGS(th) 1.0 1.6 2.5 Vdc VDS = VGS, ID =250 µAdc On-State Drain Current ID(ON) 500 - - mA VDS 2.0V ≧ DS(ON),VGS=10Vdc - - 3.75 VGS=10Vdc, ID =500mAdc Static Drain-Source On-State Voltage VDS(ON) - - 0.375 Vdc VGS=5Vdc, ID =50mAdc - 1.4 7.5 VGS=10Vdc, ID =500mAdc Static Drain-Source On-State Resistance (TA=25°C) RDS(ON) - 1.8 7.5 VGS=5Vdc, ID =50mAdc - - 13.5 VGS=10Vdc, ID =500mAdc Static Drain-Source On-State Resistance (TA=125°C) RDS(ON) - - 13.5 VGS=5Vdc, ID =50mAdc Forward Transconductance gFS 80 - - mmhos VDS 2V ≧ DS(ON),ID =200mAdc DYNAMIC CHARACTERISTICS Input Capacitance Ciss - 17 50 pF VDS=25Vdc, VGS=0, f=1MHz Output Capacitance Coss - 10 25 pF VDS=25Vdc, VGS=0, f=1MHz Reverse Transfer Capacitance Crss - 2.5 5.0 pF VDS=25Vdc, VGS=0, f=1MHz SWITCHING CHARACTERISTICS 1 Turn-On Delay Time td(ON) - 7 20 Turn-Off Delay Time td(OFF) - 11 40 nS VDD=25Vdc, ,ID ≅500mAdc RG=25 ,RL=50 , VGEN=10V BODY-DRAIN DIODE RATINGS Diode Forward On-Voltage VSD - - -1.5 Vdc IS=11.5mAdc,VGS=0V Source Current Continuous(Body Diode) IS - - -115 mAdc Source Current Pulsed ISM - - -800 mAdc Note: 1. Pulse Test: Pulse Width ≦300 µs, Duty Cycle ≦ 2.0% Millimeter Millimeter REF. Min. Max. REF. Min. Max. A 2.80 3.04 G 0.013 0.10 B 2.10 2.55 H 0.45 0.60 C 1.20 1.40 J 0.08 0.177 D 0.89 1.15 K 0.6 REF. E 1.80 2.00 L 0.89 1.02 F 0.30 0.50 SOT-23 1 Gate 2 Source Drain 3 |
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