Switching Diode Array

Steering Diode TVS Array™

S C O T TS DALE DIVISION

MAD1106 and MAD1106e3

DESCRIPTION

APPEARANCE

These low capacitance diode arrays are multiple, discrete, isolated

junctions fabricated by a planar process and mounted in a 14-pin package

for use as steering diodes protecting up to eight I/O ports from negative

ESD, EFT, or surge by directing them to ground (pin 14)*. They may also

be used in fast switching core-driver applications. This includes computers

and peripheral equipment such as magnetic cores, thin-film memories,

plated-wire memories, etc., as well as decoding or encoding applications.

These arrays offer many advantages of integrated circuits such as high-

density packaging and improved reliability. This is a result of fewer pick

and place operations, smaller footprint, smaller weight, and elimination of

various discrete packages that may not be as user friendly in PC board

mounting. They are available with either Tin-Lead plating terminations or

as RoHS Compliant with annealed matte-Tin finish by adding an “e3” suffix

to the part number.

*See MMAD1105(e3) for directing positive transients to positive side of

the power supply line.

Top Viewing Pin Layout

IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com

Microsemi

Scottsdale Division

Page 1

FEATURES

APPLICATIONS / BENEFITS

•

8 Diode Array

•

Molded 14-Pin Dual-In-Line Package

•

UL 94V-0 Flammability Classification

•

Low Capacitance 1.5 pF per diode

•

Switching speeds less than 5 ns

•

RoHS Compliant devices available by adding “e3” suffix

•

IEC 61000-4 compatible

61000-4-2 (ESD): Air 15kV, contact – 8 kV

61000-4-4 (EFT): 40A – 5/50 ns

61000-4-5 (surge): 12A, 8/20

µs

• Low capacitance steering diode protection for high

frequency data lines

• RS-232 & RS-422 Interface Networks

• Ethernet: 10 Base T

• Computer I / O Ports

• LAN

• Switching Core Drivers

MAXIMUM RATINGS

MECHANICAL AND PACKAGING

• Operating Temperature: -55°C to +150°C

• Storage Temperature: -55°C to +150°C

• Forward Surge Current: 2 Amps (8.3 ms)

12 Amps (8/20

• Continuous Forward Current: 400 mA (one diode)

• Power Dissipation (P

• Solder temperatures: 260°C for 10 s (maximum)

• CASE: Void-free transfer molded thermosetting

epoxy body meeting UL94V-0 flammability

classification

• TERMINALS: Tin-Lead or RoHS Compliant

annealed matte-Tin plating solderable per MIL-STD-

750 method 2026

• MARKING: MSC logo, MAD1106 or MAD1106e3 and

date code. Pin #1 is to the left of the dot or indent on

top of package.

• WEIGHT: 0.997 grams (approximate)

• Carrier tubes: 25 pcs (Standard)

ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless otherwise specified

BREAKDOWN

VOLTAGE

V

WORKING

PEAK

REVERSE

VOLTAGE

V

LEAKAGE

CURRENT

µA

LEAKAGE

CURRENT

µA

CAPACITANCE

C

@ 0 V

pF

REVERSE

RECOVERY

TIME

ns

FORWARD

VOLTAGE

V

FORWARD

VOLTAGE

V

PART

NUMBER

MIN

MAX

MAX

MAX

TYP

MAX

MAX

MAX

MAD1106

MAD1106e3

90

75

0.200

20

300

20

1.5

5.0

1.00

1.20

Copyright

© 2005

6-28-2005 REV L

8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503