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NX7102 Datasheet(PDF) 2 Page - Microsemi Corporation

Part # NX7102
Description  3A High Voltage Synchroous Buck Converter
PDF  12 Pages
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Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

NX7102 Datasheet(HTML) 2 Page - Microsemi Corporation

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NX7102
PRODUCTION DATA SHEET
Microsemi
Analog Mixed Signal Group
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
3A High Voltage Synchroous Buck Converter
TM
®
Copyright
© 2010
Rev.1.3, 2011-04-22
ABSOLUTE MAXIMUM RATINGS
Supply Input Voltage (VIN)............................................................................ -0.3V to 20V
Switch Voltage (SW) ............................................................................. -1V to (VIN + 1V)
EN ................................................................................................... -0.3V to (VIN + 0.3V)
BST ...................................................................................................-0.3V to (VSW + 6V)
COMP, FB, SS ................................................................................................. -0.3V to 6V
Maximum Operating Junction Temperature............................................................... 150
°C
Storage Temperature Range ........................................................................ -65
°C to 150°C
Package Peak Temp. for Solder Reflow (40 seconds maximum exposure)................ 260°C
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal
.
PACKAGE PIN OU T
4
3
2
1
5
6
7
8
BST
GND
SW
VIN
FB
COMP
EN
SS
DE PACKAGE
(Top View)
DE PART MARKING
“xxxx” Denote Date Code and Lot Identification
RoHS / Pb-free 100% Matte Tin Pin Finish
THERMAL DATA
DE Plastic SOIC 8-Pin With Exposed Pad
THERMAL RESISTANCE
-JUNCTION TO AMBIENT,
θ
JA
75
°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJA).
The
θ
JA numbers are guidelines for the thermal performance of the device/pc-board system. All of the
above assume no ambient airflow.
FUNCTIO N AL PIN DESCRIP T ION
Pin
Name
Description
1
BST
Bootstrap pin. A minimum 10nF bootstrap capacitor is connected between the BS pin and SW pin.
The voltage across the bootstrap capacitor drives the internal high side NMOS.
2
VIN
Supply input pin. A capacitor should be connected between the IN pin and GND pin to keep the
input voltage constant.
3
SW
Power switch output pin. This pin is connected to the inductor and bootstrap capacitor.
4
GND
Ground.
5
FB
Feedback pin. This pin is connected to an external resistor divider to program the system output
voltage. When the FB pin voltage exceeds 20% of the nominal regulation value of 0.925V, the over
voltage protection is triggered. When the FB pin voltage is below 0.3V, the oscillator frequency is
lowered to realize short circuit protection.
6
COMP
Compensation pin. This pin is the output of the transconductance error amplifier and the input to
the current comparator. It is used to compensate the control loop. Connect a series RC network
from this pin to GND. In some cases, an additional capacitor from this pin to GND pin is required.
7
EN
Control input pin. Forcing this pin above 1.5V enables the IC. Forcing this pin below 0.4V shuts
down the IC. When the IC is in shutdown mode, all functions are disabled to decrease the supply
current below 1μA.
8
SS
Soft-start control input pin. SS controls the soft start period. Connect a capacitor from SS to GND
to set the soft-start period. A 0.1μF capacitor sets the soft-start period to 9ms. To disable the soft-
start feature, leave SS unconnected.



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