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NX7102 Datasheet(PDF) 2 Page - Microsemi Corporation |
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NX7102 Datasheet(HTML) 2 Page - Microsemi Corporation |
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2 / 12 page ![]() NX7102 PRODUCTION DATA SHEET Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 2 3A High Voltage Synchroous Buck Converter TM ® Copyright © 2010 Rev.1.3, 2011-04-22 ABSOLUTE MAXIMUM RATINGS Supply Input Voltage (VIN)............................................................................ -0.3V to 20V Switch Voltage (SW) ............................................................................. -1V to (VIN + 1V) EN ................................................................................................... -0.3V to (VIN + 0.3V) BST ...................................................................................................-0.3V to (VSW + 6V) COMP, FB, SS ................................................................................................. -0.3V to 6V Maximum Operating Junction Temperature............................................................... 150 °C Storage Temperature Range ........................................................................ -65 °C to 150°C Package Peak Temp. for Solder Reflow (40 seconds maximum exposure)................ 260°C Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of specified terminal . PACKAGE PIN OU T 4 3 2 1 5 6 7 8 BST GND SW VIN FB COMP EN SS DE PACKAGE (Top View) DE PART MARKING “xxxx” Denote Date Code and Lot Identification RoHS / Pb-free 100% Matte Tin Pin Finish THERMAL DATA DE Plastic SOIC 8-Pin With Exposed Pad THERMAL RESISTANCE -JUNCTION TO AMBIENT, θ JA 75 °C/W Junction Temperature Calculation: TJ = TA + (PD x θJA). The θ JA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow. FUNCTIO N AL PIN DESCRIP T ION Pin Name Description 1 BST Bootstrap pin. A minimum 10nF bootstrap capacitor is connected between the BS pin and SW pin. The voltage across the bootstrap capacitor drives the internal high side NMOS. 2 VIN Supply input pin. A capacitor should be connected between the IN pin and GND pin to keep the input voltage constant. 3 SW Power switch output pin. This pin is connected to the inductor and bootstrap capacitor. 4 GND Ground. 5 FB Feedback pin. This pin is connected to an external resistor divider to program the system output voltage. When the FB pin voltage exceeds 20% of the nominal regulation value of 0.925V, the over voltage protection is triggered. When the FB pin voltage is below 0.3V, the oscillator frequency is lowered to realize short circuit protection. 6 COMP Compensation pin. This pin is the output of the transconductance error amplifier and the input to the current comparator. It is used to compensate the control loop. Connect a series RC network from this pin to GND. In some cases, an additional capacitor from this pin to GND pin is required. 7 EN Control input pin. Forcing this pin above 1.5V enables the IC. Forcing this pin below 0.4V shuts down the IC. When the IC is in shutdown mode, all functions are disabled to decrease the supply current below 1μA. 8 SS Soft-start control input pin. SS controls the soft start period. Connect a capacitor from SS to GND to set the soft-start period. A 0.1μF capacitor sets the soft-start period to 9ms. To disable the soft- start feature, leave SS unconnected. |
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