MAX6895PAL datasheet(2/15 Pages) MAXIM

2 / 15 page

Ultra-Small, Adjustable

Sequencing/Supervisory Circuits

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ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(VCC = 1.5V to 5.5V, TA = -40°C to +125°C, unless otherwise specified. Typical values are at VCC = 3.3V and TA = +25°C, unless

otherwise noted.) (Note 2)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

VCC, ENABLE, ENABLE, IN....................................-0.3V to +6V

OUT,

OUT (push-pull) ................................-0.3V to (VCC + 0.3V)

OUT,

OUT (open-drain)..........................................-0.3V to +30V

CDELAY......................................................-0.3V to (VCC + 0.3V)

Output Current (all pins) ...................................................±20mA

Continuous Power Dissipation (TA = +70°C)

6-Pin µDFN (derate 2.1mW/°C above +70°C)...........167.7mW

6-Pin Thin SOT23 (derate 9.1mW/°C above +70°C) ...727.3mW

Operating Temperature Range .........................-40°C to +125°C

Storage Temperature Range .............................-65°C to +150°C

Junction Temperature ......................................................+150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow) .......................................+260°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

SUPPLY

Operating Voltage Range

VCC

1.5

5.5

Undervoltage Lockout (Note 3)

UVLO

VCC falling

1.20

1.35

VCC Supply Current

ICC

VCC = 3.3V, no load

µA

Threshold Voltage

VTH

VIN rising, 1.5V < VCC < 5.5V

0.491

0.5

0.509

Hysteresis

VHYST

VIN falling

Input Current (Note 4)

IIN

VIN = 0V or VCC

-15

+15

CDELAY

Delay Charge Current

ICD

200

250

300

Delay Threshold

VTCD

CDELAY rising

0.95

1.00

1.05

CDELAY Pulldown Resistance

RCDELAY

130

500

Ω

ENABLE/

ENABLE

Input Low Voltage

VIL

0.4

Input High Voltage

VIH

1.4

Input Leakage Current

ILEAK

ENABLE, ENABLE = VCC or GND

-100

+100

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four

layer board. For detailed information on package thermal considerations refer to www.maxim-ic.com/thermal-tutorial.

PACKAGE THERMAL CHARACTERISTICS (Note 1)

µDFN

Junction-to-Ambient Thermal Resistance (

θJA)...............477°C/W

Junction-to-Case Thermal Resistance (

θJC)......................122°C/W

Thin SOT23

Junction-to-Ambient Thermal Resistance (

θJA)................110°C/W

Junction-to-Case Thermal Resistance (

θJC).......................50°C/W

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