E647ATF datasheet(8/13 Pages) SEMTECH

8 / 13 page

2000 Semtech Corp.

www.semtech.com

EDGE HIGH-PERFORMANCE PRODUCTS

Edge647

Package Information

(continued)

DETAIL "A"

e / 2

0 MIN.

0.08 / 0.20 R.

GAUGE PLANE

0.25

0 – 7

C.08

R. MIN.

0.20 MIN.

1.00 REF.

DATUM

PLANE

– H –

0.05

–

DETAIL "B"

;;;

ddd

A – B

WITH LEAD FINISH

Lead

Cross Section

0.09 / 0.20

0.09 / 0.16

BASE METAL

8 PLACES

11 / 13

0.10

/ /

SEE DETAIL "B"

0.05

ccc

– H –

– C –

SECTION C–C

JEDEC VARIATION

All Dimensions in Millimeters

Min.

Nom.

Max.

Note

1.60

0.05

0.10

0.15

1.35

1.40

1.45

9.00

BSC.

7.00

BSC.

7,8

9.00

BSC.

7.00

BSC.

7,8

0.45

0.60

0.75

0.15

N32

0.80 BSC.

0.30

0.37

0.45

0.30

0.35

0.40

ccc

0.10

ddd

0.20

Notes:

All dimensions and tolerances conform to ANSI

Y14.5-1982.

Datum plane -H- located at mold parting line and

coincident with lead, where lead exits plastic

body at bottom of parting line.

Datums A-B and -D- to be determined at

centerline between leads where leads exit

plastic body at datum plane -H-.

To be determined at seating plane -C-.

Dimensions D1 and E1 do not include mold

protrusion.

“N” is the total # of terminals.

These dimensions to be determined at the

datum plane -H-.

Package top dimensions are smaller than

bottom dimensions and top of package will

not overhang bottom of package.

Dimension b does not include dambar

protrusion. Allowable dambar protrusion

shall be 0.08 mm total in excess of the b

dimension at maximum material condition.

Dambar cannot be located on the lower

radius or the foot.

10.

Controlling dimension: millimeter.

11.

Maximum allowable die thickness to be

assembled in this package family is 0.30

millimeters.

12.

This outline conforms to JEDEC publication 95,

registration MO-136, variations AC, AE, and AF.

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