PCA9552_5

© Koninklijke Philips Electronics N.V. 2006. All rights reserved.

Product data sheet

Rev. 05 — 9 March 2006

25 of 28

Philips Semiconductors

PCA9552

[2]

All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the

maximum temperature (with respect to time) and body size of the package, there is a risk that internal or

external package cracks may occur due to vaporization of the moisture in them (the so called popcorn

effect). For details, refer to the Drypack information in the

Data Handbook IC26; Integrated Circuit

Packages; Section: Packing Methods.

[3]

These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no

account be processed through more than one soldering cycle or subjected to infrared reflow soldering with

peak temperature exceeding 217

°C ± 10 °C measured in the atmosphere of the reflow oven. The package

body peak temperature must be kept as low as possible.

[4]

These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the

solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink

on the top side, the solder might be deposited on the heatsink surface.

[5]

If wave soldering is considered, then the package must be placed at a 45

° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6]

Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7]

Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger

than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8]

Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered

pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by

using a hot bar soldering process. The appropriate soldering profile can be provided on request.

[9]

Hot bar soldering or manual soldering is suitable for PMFP packages.

16. Abbreviations

Table 16:

Abbreviations

Acronym

Description

CDM

Charged Device Model

DSP

Digital Signal Processor

ESD

ElectroStatic Discharge

HBM

Human Body Model

GPIO

General Purpose Input/Output

IC

Integrated Circuit

Inter IC bus

LED

Light Emitting Diode

MCU

Microcontroller

MM

Machine Model

MPU

Microprocessor

POR

Power-On Reset

PWM

Pulse Width Modulation

SMBus

System Management Bus