Application information

L6230

18/24

Doc ID 18094 Rev 2

Figure 16.

Six-step with zero crossing detection typical application

6.4

Thermal management

In most applications the power dissipation in the IC is the main factor that sets the maximum

current that can be delivered by the device in a safe operating condition. Therefore, it has to

be taken into account very carefully. Besides the available space on the PCB, the right

package should be chosen considering the power dissipation. Heat sinking can be achieved

using copper on the PCB with proper area and thickness.

Otherwise, using a PowerSO package with copper slug soldered on a 1.5 mm copper

is about 35°C/W.

Using a multi-layer board with vias to a ground plane, thermal impedance can be reduced

down to 15°C/W.