US94061G-AG6-R datasheet(4/6 Pages) UTC

4 / 6 page

US94061

Preliminary

CMOS IC

UNISONICTECHNOLOGIESCO.,LTD

4 of 6

www.unisonic.com.tw

Ver.A

ABSOLUTE MAXIMUM RATING

PARAMETER

SYMBOL

RATINGS

UNIT

Input Voltage

VIN

Enable Voltage

VEN

TA= 25°C

±2

Continuous Drain Current (Note 3)

TA= 85°C

±1.4

Pulsed Drain Current (Note 5)

IDP

±6

Continuous Diode Current (Note 7)

-50

Power Dissipation (Note 3)( TA= 85°C)

270

Operating Ratings

(Note 2)

Input Voltage Range

VIN

1.8~5.5

Junction Temperature

+150

°C

Storage Temperature (Note 4)

TSTG

-55~+150

°C

Note: Absolute maximum ratings are those values beyond which the device could be permanently damaged.

Absolute maximum ratings are stress ratings only and functional device operation is not implied.

THERMAL DATA

PARAMETER

SYMBOL

RATINGS

UNIT

Junction to Ambient (Note 3)

θJA

240

°C/W

ELECTRICAL CHARACTERISTICS （TA = 25°C, unless otherwise specified.）

PARAMETER

SYMBOL

TEST CONDITIONS

MIN

TYP MAX

UNIT

Static

EN Threshold Voltage

VTHD(EN)) VIN= 1.8V ~ 4.5V, ID= -250µA

0.5

1.2

EN Input Current (Quiescent Current)

IQ(EN)

VIN= VEN= 5.5V

µA

OFF State Leakage Current

ILEAK

VEN= OPEN or 0V, VIN= +5.5V

µA

VIN= 4.5V, ID= -100 mA, VEN= 1.5V

175

200

VIN= 3.6V, ID= -100 mA, VEN= 1.5V

185

215

VIN= 2.5V, ID= -100 mA, VEN= 1.5V

205

245

P-Channel Drain-Source

On-Resistance

RDS(ON)

VIN= 1.8V, ID= -100 mA, VEN= 1.5V

270

325

mΩ

Turn-OFF Impedance

RSHDN

VIN= 3.6V, VEN= 0V or OPEN

200

300

Ω

Dynamic

(Note 6)

Turn-ON Delay Time

tD(ON)

VIN= 3.6V, ID= -100mA, VEN= 1.5V

850

1500

Turn-ON Rise Time

VIN= 3.6V, ID= -100mA, VEN= 1.5V

0.5

µs

Turn-OFF Delay Time

tD(OFF)

VIN= 3.6V, ID= -100mA, VEN= 1.5V

100

150

Turn-OFF Fall Time

VIN= 3.6V, ID= -100mA, VEN= 1.5V

100

Note: 1.TA = 25°C unless otherwise noted. Absolute maximum ratings indicate limits beyond which damage to the

component may occur. Electrical specifications do not apply when operating the device outside of its

operating ratings. The maximum allowable power dissipation is a function of the maximum junction

temperature, TJ(Max), the junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA.

2. This device is not guaranteed to operate beyond its specified operating rating.

3. Mounted on 1 square-inch pad of 2 oz. copper.

4. IC devices are inherently ESD sensitive. Handling precautions required.

5. Pulse width < 300µs with <2% duty cycle.

6. Dynamic specifications are guaranteed by design.

7. Body diode current conduction is not recommended.

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