| Electronic Components Datasheet Search |
|
BSP52T3G Datasheet(PDF) 1 Page - ON Semiconductor |
|
|
|||||||||||||||||||||||||||||
BSP52T3G Datasheet(HTML) 1 Page - ON Semiconductor |
|
1 / 3 page ![]() © Semiconductor Components Industries, LLC, 2010 September, 2010 − Rev. 6 1 Publication Order Number: BSP52T1/D BSP52T1G, BSP52T3G NPN Small-Signal Darlington Transistor This NPN small signal Darlington transistor is designed for use in switching applications, such as print hammer, relay, solenoid and lamp drivers. The device is housed in the SOT-223 package, which is designed for medium power surface mount applications. Features • The SOT-223 Package can be soldered using wave or reflow. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die • Available in 12 mm Tape and Reel Use BSP52T1 to Order the 7 Inch/1000 Unit Reel • PNP Complement is BSP62T1 • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant MAXIMUM RATINGS (TC = 25°C unless otherwise noted) Rating Symbol Max Unit Collector-Emitter Voltage VCES 80 Vdc Collector-Base Voltage VCBO 90 Vdc Emitter-Base Voltage VEBO 5.0 Vdc Collector Current IC 1.0 Adc Total Power Dissipation (Note 1) @ TA = 25°C Derate above 25°C PD 0.8 6.4 W mW/°C Total Power Dissipation (Note 2) @ TA = 25°C Derate above 25°C PD 1.25 10 W mW/°C Operating and Storage Temperature Range TJ, Tstg −65 to 150 °C THERMAL CHARACTERISTICS Characteristic Symbol Value Unit Thermal Resistance (Note 1) Junction-to-Ambient RqJA 156 °C/W Thermal Resistance (Note 2) Junction-to-Ambient RqJA 100 °C/W Maximum Temperature for Soldering Purposes Time in Solder Bath TL 260 10 °C Sec Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Device mounted on a FR-4 glass epoxy printed circuit board using minimum recommended footprint. 2. Device mounted on a FR-4 glass epoxy printed circuit board using 1 cm2 pad. Device Package Shipping† ORDERING INFORMATION MARKING DIAGRAM SOT−223 CASE 318E STYLE 1 3 2 1 COLLECTOR 2,4 BASE 1 EMITTER 3 4 AYW AS3G G A = Assembly Location Y = Year W = Work Week AS3 = Specific Device Code G = Pb−Free Package (Note: Microdot may be in either location) MEDIUM POWER NPN SILICON SURFACE MOUNT DARLINGTON TRANSISTOR BSP52T1G SOT−223 (Pb−Free) 1000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com BSP52T3G SOT−223 (Pb−Free) 4000/Tape & Reel |
Similar Part No. - BSP52T3G |
|
Similar Description - BSP52T3G |
|
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |