8

Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications

at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by

Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any

infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any

patent or patent rights of Intersil or its subsidiaries.

FN2479.3

January 6, 2011

For additional products, see www.intersil.com/product_tree

Die Characteristics

DIE DIMENSIONS:

85 x 101 mils

2.16 x 2.57mm

METALLIZATION:

Type: AlSi

Metal Thickness: 11k

GLASSIVATION:

Thickness: 13k

WORST CASE CURRENT DENSITY:

BOND PAD SIZE:

100µm x 100µm

4 x 4 mils

Metallization Mask Layout

HCS154MS

Y0

(1)

Y1

(2)

Y2 (3)

Y3 (4)

Y4 (5)

Y5 (6)

Y6 (7)

Y7 (8)

Y8 (9)

Y9 (10)

(11)

Y10

(12)

GND

(13)

Y11

(14)

Y12

(15)

Y13

(21) A2

(20) A3

(19) E2

(18) E1

(17) Y15

(16) Y14

VCC

(24)

A0

(23)

A1

(22)

HCS154MS