E48SH3R330_05142009

12

LEADED (Sn/Pb) PROCESS RECOMMENDED TEMPERATURE PROFILE

Time ( sec. )

Pre-heat temp.

140~180°C 60~120 sec.

Peak temp.

210~230°C 5sec.

Ramp-up temp.

0.5~3.0°C /sec.

50

100

150

200

250

300

60

0

120

180

240

2nd Ramp-up temp.

1.0~3.0°C /sec.

Over 200°C

40~50sec.

Cooling down rate <3°C /sec.

Note: The temperature refers to the pin of E48SH, measured on the pin +Vout joint.

LEAD FREE (SAC) PROCESS RECOMMENDED TEMPERATURE PROFILE

Time

150℃

200℃

100~140 sec.

Time Limited 90 sec.

above 217℃

217℃

Preheat time

Ramp up

max. 3℃/sec.

Ramp down

max. 4℃/sec.

Peak Temp. 240 ~ 245 ℃

25℃

Note: The temperature refers to the pin of E48SH, measured on the pin +Vout joint.

* For modules with through-hole pins and the optional heatspreader, they are intended for wave soldering

assembly onto system boards; please do not subject such modules through reflow temperature profile.