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SM6TY Datasheet(PDF) 7 Page - STMicroelectronics |
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SM6TY Datasheet(HTML) 7 Page - STMicroelectronics |
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7 / 11 page ![]() SM6TY Characteristics Doc ID 17741 Rev 1 7/11 Figure 12. Relative variation of thermal impedance, junction to ambient, versus pulse duration Figure 13. Thermal resistance junction to ambient versus copper surface under each lead Zth (j-a)/Rth (j-a) 0.01 0.10 1.00 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03 Recommended pad layout Printed circuit board FR4, copper thickness = 35 µm ms tp R th(j-a) (°C/W) 0 10 20 30 40 50 60 70 80 90 100 110 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Printed circuit board FR4, copper thickness = 35 µm SCu(cm²) Figure 14. Leakage current versus junction temperature (typical values) Figure 15. Peak forward voltage drop versus peak forward current (typical values) I R (nA) 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 25 50 75 100 125 150 V R=VRM V RM ≥ 10 V V R=VRM V RM < 10 V T (° C) j 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 0.0 0.5 1.0 1.5 2.0 2.5 3.0 I FM(A) T j =25 °C T j =125 °C VFM(V) |
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