MAX13047E datasheet(2/15 Pages) MAXIM

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ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(VCC = +1.65V to +5.5V, VL = +1.1V to minimum of either +3.6V or ((VCC + 0.3V)), I/O VL and I/O VCC are unconnected, TA = -40°C to

+85°C, unless otherwise noted. Typical values are VCC = +3.3V, VL = +1.8V at TA = +25°C.) (Notes 2, 3)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

(All voltages referenced to GND.)

VCC ...........................................................................-0.3V to +6V

VL..............................................................................-0.3V to +4V

I/O VCC .......................................................-0.3V to (VCC + 0.3V)

I/O VL ............................................................-0.3V to (VL + 0.3V)

SHDN........................................................................-0.3V to +6V

Short-Circuit Duration I/O VL, I/O VCC to GND...........Continuous

Power Dissipation (TA = +70°C)

6-Pin µDFN (derate 2.1mW/°C above +70°C) .............168mW

10-Pin UTQFN (derate 6.9mW/°C above +70°C).........559mW

Junction-to-Ambient Thermal Resistance (

θJA) (Note 1)

6-Pin µDFN .................................................................477°C/W

10-Pin UTQFN ...........................................................20.1°C/W

Junction-to-Ambient Thermal Resistance (

θJC) (Note 1)

6-Pin µDFN ................................................................20.1°C/W

10-Pin UTQFN .........................................................143.1°C/W

Operating Temperature Range ...........................-40°C to +85°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

POWER SUPPLY

VCC > 3.3V

1.1

3.6V

VL Supply Range

VCC

≤ 3.3V

1.1

VCC + 0.3V

VCC Supply Range

VCC

1.65

5.5

Supply Current from VCC

IQVCC

µA

Supply Current from VL

IQVL

µA

VCC Shutdown-Mode Supply Current

ISD-VCC

TA = +25°C, SHDN = GND

0.03

1µA

VL Shutdown-Mode Supply Current

ISD-VL

TA = +25°C, SHDN = GND

0.03

1µA

I/O VL and I/O VCC Shutdown-Mode

Leakage Current

ISD-LKG

TA = +25°C, SHDN = GND

0.02

0.5

µA

SHDN Input Leakage

TA = +25°C

0.02

0.1

µA

ESD PROTECTION

Human Body Model

±15V

IEC 61000-4-2 Air-Gap Discharge

±15V

I/O VCC (Note 4)

IEC 61000-4-2 Contact Discharge

±8V

All Other Pins

Human Body Model

±2

LOGIC-LEVEL THRESHOLDS

I/O VL Input-Voltage High

VIHL

VL -

0.2

I/O VL Input-Voltage Low

VILL

0.15

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

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