MAX14521E datasheet(2/20 Pages) MAXIM

2 / 20 page

Quad, High-Voltage EL Lamp Driver

with I2C Interface

_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(VDD = +2.7V to +5.5V, total CLAMP = 10nF, CCS = 3.3nF, tapped inductor = 2.3µH/115µH, 1:7 ratio (ISAT = 0.7A, RS = 1

Ω),

TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C and VDD = 3.7V.) (Note 2)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

(All voltages referenced to GND, unless otherwise noted.)

VDD ........................................................................-0.3V to +6.0V

CS, EL1, EL2, EL3, EL4, COM..............................-0.3V to +160V

LX ...........................................................................-0.3V to +33V

RB, A0, A1, AUX....................................................-0.3V to +6.0V

SCL, SDA....................................................-0.3V to (VDD + 0.3V)

Continuous Power Dissipation (TA = +70°C)

24-Pin TQFN-EP (derate 27.8mW/°C above +70°C)..2222mW

Package Junction-to-Ambient Thermal Resistance (

θJA)

(Note 1) ........................................................................36°C/W

Package Junction-to-Case Thermal Resistance (

θJC)

(Note 1) ..........................................................................3°C/W

Operating Temperature Range ...........................-40°C to +85°C

Storage Temperature Range .............................-65°C to +150°C

Junction Temperature ......................................................+150°C

Lead Temperature (soldering, 10s) .................................+300°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Input Voltage

VDD

2.7

5.5

Battery Voltage

VBAT

(Note 3)

13.2

Input Supply Current

IDD

All channels on, 300VP-P, fEL = 200Hz, sine-

wave output shape

350

900

µA

TA = +25°C

100

Shutdown Supply Current

ISHDN

RB, A0, A1 = 0V or VDD;

SCL = SDA = GND or

VDD; not toggling

TA = -40°C to

+85°C

300

Shutdown Tapped-Inductor

Supply Current

ILX_SHDN

2100

Undervoltage Lockout

VUV

VDD rising

1.6

2.0

2.5

UVLO Hysteresis

VUV_HYST

EL OUTPUTS (EL_, COM)

VEL_ - VCOM; EL_ _[4:0] = 01000; VDD = 3.7V

VEL_ - VCOM; EL_ _[4:0] = 10000; VDD = 3.7V

136

154

172

Peak-to-Peak Output Voltage

VP-P

VEL_ - VCOM; EL_ _[4:0] = 11111; VDD = 3.7V

268

300

320

Max Average Output Voltage

VAVG

VEL_ - VCOM

EL_ High-Side Switch

On-Resistance

RONHS_EL_

1270

EL_ Low-Side Switch

On-Resistance

RONLS_EL_

700

COM High-Side Switch

On-Resistance

RONHS_COM

390

COM Low-Side Switch

On-Resistance

RONLS_COM

175

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