For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

7

7 - 18

Outline Drawing

Part Number

Package Body Material

Lead Finish

MSL Rating

Package Marking

[3]

HMC188MS8

Low Stress Injection Molded Plastic

Sn/Pb Solder

MSL1

[1]

H188

XXXX

HMC188MS8E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL1

[2]

H188

XXXX

[1] Max peak reflow temperature of 235 °C

[2] Max peak reflow temperature of 260 °C

[3] 4-Digit lot number XXXX

Package Information

GaAs MMIC SMT PASSIVE FREQUENCY

DOUBLER, 1.25 - 3.0 GHz INPUT

v04.0709

NOTES:

1. LEADFRAME MATERIAL: COPPER ALLOY

2. DIMENSIONS ARE IN INCHES [MILLIMETERS].

3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.

4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.

5. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.

Pin Description

Pin Number

Function

Description

Interface Schematic

1, 3 - 6, 8

GND

All ground leads must be soldered to PCB RF/DC ground.

2

RFIN

Pin is DC coupled and matched to 50 Ohms from 1.25 to 3.0 GHz

7

RFOUT

Pin is DC coupled and matched to 50 Ohms from 2.5 to 6.0 GHz