BeRex

BCIF7

http: //www.berex.com

RF Bandwidth Application (Vc=5V, Ic=95mA, T=25

°C)

Freq

[MHz]

S11

[dB]

S11

[Ang]

S21

[dB]

S21

[Ang]

S12

[dB]

S12

[Ang]

S22

[dB]

S22

[Ang]

500

-9.933

-62.036

26.655

140.862

-32.054

5.690

-6.741

95.975

600

-11.592

-69.083

27.012

114.561

-30.891

-10.142

-10.421

66.190

700

-12.970

-75.467

26.862

90.690

-30.452

-21.447

-14.326

28.112

800

-13.821

-81.199

26.486

70.988

-31.196

-39.664

-16.186

-31.310

900

-14.577

-89.643

26.003

51.737

-30.634

-47.501

-14.438

-74.036

1000

-15.849

-105.713

25.350

31.493

-29.676

-65.002

-11.274

-101.616

1100

-16.947

-116.273

25.174

17.566

-29.279

-73.650

-9.931

-115.456

1200

-18.847

-127.822

24.486

3.151

-29.542

-89.241

-8.173

-139.546

1300

-19.853

-145.186

23.909

-13.503

-29.542

-89.241

-8.173

-139.546

1400

-20.891

-168.828

23.719

-27.530

-28.848

-96.767

-7.982

-149.506

1500

-22.903

162.772

23.175

-42.466

-28.517

-107.766

-7.466

-156.464

* Note : S-parameter includes 1 mil thick and 16-mil long Au wire

Die Outline

NOTES:

1) DIE THICKNESS 100um

2) BONDPAD METAL

THICKNESS 2.8um

3) BACKSIDE METAL Au, 5um

4) DEVICE IS GROUNDED

THROUGH VIA HOLES