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552LP4E Datasheet(PDF) 5 Page - Hittite Microwave Corporation

Part # 552LP4E
Description  GaAs MMIC MIXER w/ INTEGRATED LO AMPLIFIER, 1.6 - 3.0 GHz
PDF  8 Pages
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Manufacturer  HITTITE [Hittite Microwave Corporation]
Direct Link  http://www.hittite.com
Logo HITTITE - Hittite Microwave Corporation

552LP4E Datasheet(HTML) 5 Page - Hittite Microwave Corporation

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For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
10
10 - 5
Outline Drawing
Absolute Maximum Ratings
rF / iF input (Vcc= +5V)
+31 dBm
LO Drive (Vcc= +5V)
+10 dBm
BiAs
+7 Vdc
Junction Temperature
150°C
Continuous Pdiss (T = 85°C)
(derate 9.5 mW/°C above 85°C)
0.6 W
Thermal resistance
(junction to ground paddle)
105.6 °C/W
storage Temperature
-65 to +150°C
Operating Temperature
-40 to +85°C
esD sensitivity (HBM)
Class 1C
eLeCTrOsTATiC seNsiTiVe DeViCe
OBserVe HANDLiNG PreCAUTiONs
NOTes:
1. LeADFrAMe MATeriAL: COPPer ALLOY
2. DiMeNsiONs Are iN iNCHes [MiLLiMeTers]
3. LeAD sPACiNG TOLerANCe is NON-CUMULATiVe.
4. PAD BUrr LeNGTH sHALL Be 0.15mm MAxiMUM.
PAD BUrr HeiGHT sHALL Be 0.05mm MAxiMUM.
5. PACKAGe WArP sHALL NOT exCeeD 0.05mm.
6. ALL GrOUND LeADs AND GrOUND PADDLe MUsT Be
sOLDereD TO PCB rF GrOUND.
7. reFer TO HiTTiTe APPLiCATiON NOTe FOr sUGGesTeD
LAND PATTerN.
Part Number
Package Body Material
Lead Finish
MsL rating
Package Marking [3]
HMC552LP4
Low stress injection Molded Plastic
sn/Pb solder
MsL1
[1]
H552
xxxx
HMC552LP4e
roHs-compliant Low stress injection Molded Plastic
100% matte sn
MsL1
[2]
H552
xxxx
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number xxxx
Package Information
HMC552LP4 / 552LP4E
v03.1210
GaAs MMIC MIXER w/ INTEGRATED
LO AMPLIFIER, 1.6 - 3.0 GHz



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