VSMP Series (0805, 1206, 1506, 2010, 2512) (Z-Foil)

Vishay Foil Resistors

www.foilresistors.com

Document Number: 63060

2

Revision: 25-Mar-10

Note

Note

Ω to allow for measurement errors at low values.

FIGURE 2 - TRIMMING TO VALUES

(Conceptual Illustration)

Mutual Inductance

Reduction due

to Change in

Current Direction

Current Path

Before Trimming

Note: Foil shown in black, etched spaces in white

Interloop Capacitance

Reduction in Series

Trimming Process

Removes this Material

from Shorting Strip Area

Changing Current Path

and Increasing

Resistance

Current Path

After Trimming

FIGURE 3 - TYPICAL RESISTANCE/

TEMPERATURE CURVE

Note

• The TCR values for < 100

Ω are influenced by the termination

composition and result in deviation from this curve.

+ 200

+ 100

0

- 100

- 200

- 300

- 500

- 55

- 25

+ 25

+ 60

+ 75

+ 100

+ 125

ΔR

R

(ppm)

0

0.05 ppm/°C

- 0.1 ppm/°C

0.1 ppm/°C

0.14 ppm/°C

0.2 ppm/°C

- 0.16 ppm/°C

- 400

+ 300

+ 400

Ambient Temperature (°C) and TCR Chord Slopes for

Different Temperature Ranges

TABLE 2 - DIMENSIONS AND LAND PATTERN in Inches (Millimeters)

CHIP

SIZE

L

± 0.005 (0.13)

W

± 0.005 (0.13)

THICKNESS

MAXIMUM

D

± 0.005 (0.13)

0805

0.080 (2.03)

0.050 (1.27)

0.025 (0.64)

0.015 (0.38)

0.122 (3.10)

0.028 (0.71)

0.050 (1.27)

1206

0.126 (3.20)

0.062 (1.57)

0.025 (0.64)

0.020 (0.51)

0.175 (4.45)

0.059 (1.50)

0.071 (1.80)

1506

0.150 (3.81)

0.062 (1.57)

0.025 (0.64)

0.020 (0.51)

0.199 (5.05)

0.083 (2.11)

0.071 (1.80)

2010

0.198 (5.03)

0.097 (2.46)

0.025 (0.64)

0.025 (0.64)

0.247 (6.27)

0.115 (2.92)

0.103 (2.62)

2512

0.249 (6.32)

0.127 (3.23)

0.025 (0.64)

0.032 (0.81)

0.291 (7.39)

0.150 (3.81)

0.127 (3.23)

Top View

D

T

W

L

Recommended Land Pattern

Footprint

Z

G

X

TABLE 3 - SPECIFICATIONS

CHIP

SIZE

RATED

POWER

(mW)

at + 70 °C

MAX.

WORKING

VOLTAGE

(

≤

)

RESISTANCE

RANGE

(

Ω)

MAXIMUM

WEIGHT

(mg)

0805

200

40 V

10 to 8K

6

1206

300

87 V

10 to 25K

11

1506

300

95 V

10 to 30K

12

2010

500

187 V

10 to 70K

27

2512

750

220 V

10 to 125K

40

PR

×

TABLE 4 - LOAD LIFE STABILITY

(+ 70 °C for 2000 h)

CHIP SIZE

MAXIMUM

ΔR LIMITS

0805

± 0.005 % at 100 mW

± 0.01 % at 200 mW

1206, 1506

± 0.005 % at 150 mW

± 0.01 % at 300 mW

2010

± 0.005 % at 200 mW

± 0.01 % at 500 mW

2512

± 0.005 % at 500 mW

± 0.01 % at 750 mW

TABLE 5 - PERFORMANCES

TEST OR CONDITIONS

MIL-PRF-55342

CHARACTERISTIC E

ΔR LIMITS

TYPICAL

ΔR LIMITS

MAXIMUM

Thermal Shock, 100 x (- 65 °C to + 150 °C)

± 0.1 %

± 0.005 % (50 ppm)

± 0.01 % (100 ppm)

± 0.1 %

± 0.005 % (50 ppm)

± 0.01 % (100 ppm)

Short Time Overload, 6.25 x Rated Power, 5 s

± 0.1 %

± 0.005 % (50 ppm)

± 0.01 % (100 ppm)

High Temperature Exposure, + 150 °C, 100 h

± 0.1 %

± 0.01 % (100 ppm)

± 0.02 % (200 ppm)

Resistance to Soldering Heat

± 0.2 %

± 0.005 % (50 ppm)

± 0.01 % (100 ppm)

Moisture Resistance

± 0.2 %

± 0.005 % (50 ppm)

± 0.02 % (200 ppm)

Load Life Stability + 70 °C for 2000 h at Rated Power

± 0.5 %

± 0.005 % (50 ppm)

± 0.01 % (100 ppm)