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IC-NZP Datasheet(PDF) 2 Page - IC-Haus GmbH

Part # IC-NZP
Description  P-TYPE LASER DIODE DRIVER
PDF  15 Pages
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Manufacturer  ICHAUS [IC-Haus GmbH]
Direct Link  http://www.ichaus.biz
Logo ICHAUS - IC-Haus GmbH

IC-NZP Datasheet(HTML) 2 Page - IC-Haus GmbH

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iC-NZP
P-TYPE LASER DIODE DRIVER
Rev B1, Page 2/15
DESCRIPTION
Laser diode pulse driver iC-NZP allows CW opera-
tion of laser diodes and spike-free switching with de-
fined current pulses up to 155 MHz. The optical out-
put power of the laser diode is set-up by means of an
external resistor (RMD/PMD). For laser current con-
trol without a monitor diode, the laser current moni-
tor at pin IMON is utilised. For high pulse frequen-
cies the device can be switched into controlled burst
mode. A previously settled operating point is main-
tained throughout the burst phase.
An averaging current monitor can be set by an ex-
ternal resistor at pin RSI. When the current limit is
reached, overcurrent is signalled at NERR and the
current from pin VCCA is limited to the pre-set value
but the iC is not shut down. There is an additional
current limitation in pin LDA that prevents the iC from
overpowering the laser diode.
Setting pin NSLP low, the iC enters a low consump-
tion sleep-mode (< 50 µA typ.).
PACKAGES QFN24 4 mm x 4 mm to JEDEC
PIN CONFIGURATION
7
8
9
10
11
1
2
3
4
5
13
14
15
21
22
6
12
16
17
19
20
18
23
24
NZP
code...
...
PIN FUNCTIONS
No. Name Function
1 VDD
Power Supply
2 GND
Ground
3 MD
APC setup, monitor input
4 IMON Laser Current Monitor
5 NCID
Disable Pulldown Current at CI
6 EP
Positive LVDS/TTL switching input
7 EN
Negative LVDS switching input
8 TTL
Enable TTL input
9 VSY
Sync Output Supply Voltage
10 SYN
Sync Output
11 RGND Reference Ground
12 RVDD Reference (P-type laser diodes)
13 LDA
Laser Diode Anode
14 CI
Power Control Capacitor
15 CIS
Power Control Capacitor sense
16 VDDL Laser Power Supply
17 VDDA Analogue Power Supply
18 AVG
Averaging Control Enabled
19 RSI
Current Monitor Setup
20 REGE Control Enable
21 GND
Ground
22 NSLP Not Sleep-Mode
23 NERR Error Output
24
n/c
The Thermal Pad is to be connected to a Ground Plane (GND) on the PCB.
Only pin 1 marking on top or bottom defines the package orientation (
NZP label and coding is subject
to change).



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