New Product

BU2006 thru BU2010

Vishay General Semiconductor

Document Number: 89298

Revision: 15-Mar-11

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5

This datasheet is subject to change without notice.

FORMING SPECIFICATION: BU-5S in inches (millimeters)

APPLICATION NOTE

(1) Device UL approved for safety use dielectric strength of 1500 V.

(2) If device is mounted in Floating Ground (F. G.) application, insulator is recommended to use to meet safety requirement.

(3) Heat sink shape recommendation:

0.085 (2.16)

0.065 (1.65)

0.310 (7.9)

0.290 (7.4)

0.020R (TYP.)

0.100 (2.54)

0.085 (2.16)

0.160 (4.1)

0.140 (3.5)

0.880 (22.3)

0.860 (21.8)

0.125 (3.2) x 45°

Chamfer

0.075

(1.9) R

+

-

~~

0.080 (2.03)

0.060 (1.52)

0.050 (1.27)

0.040 (1.02)

0.213 (5.40)

0.173 (4.40)

0.417 (10.60)

0.370 (9.40)

0.080 (2.03)

0.065 (1.65)

0.319 (8.10)

0.272 (6.90)

0.319 (8.10)

0.272 (6.90)

0.315 (8.0)

0.276 (7.0)

0.028 (0.72)

0.020 (0.52)

0.219 (5.55)

MAX.

0.161 (4.10)

0.142 (3.60)

0.740 (18.8)

0.720 (18.3)

5°

TYP.

9°

TYP.

0.134 (3.40)

0.087 (2.20)

2.5 mm MIN.

2.5 mm MIN.

By Safety Requirements

Heatsink

(3)