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HT75B33 Datasheet(PDF) 14 Page - Holtek Semiconductor Inc |
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HT75B33 Datasheet(HTML) 14 Page - Holtek Semiconductor Inc |
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14 / 15 page ![]() Rev. 1.00 14 August, 9, 2011 HT75Bxx Carrier Tape Dimensions P D1 W P1 P0 D E F t K0 B0 A0 C IC M ar ki ng R eel H ol e SOT23-5 Symbol Description Dimensions in mm W Carrier Tape Width 8.0±0.3 P Cavity Pitch 4.0±0.1 E Perforation Position 1.75±0.10 F Cavity to Perforation(Width Direction) 3.50±0.05 D Perforation Diameter 1.5+0.1/-0.0 D1 Cavity Hole Diameter 1.5+0.1/-0.0 P0 Perforation Pitch 4.0±0.1 P1 Cavity to Perforation(Length Direction) 2.00±0.05 A0 Cavity Length 3.15±0.10 B0 Cavity Width 3.2±0.1 K0 Cavity Depth 1.4±0.1 t Carrier Tape Thickness 0.20±0.03 C Cover Tape Width 5.3±0.1 SOT89-3 Symbol Description Dimensions in mm W Carrier Tape Width 12.0 +0.3/-0.1 P Cavity Pitch 8.0±0.1 E Perforation Position 1.75±0.10 F Cavity to Perforation(Width Direction) 5.50±0.05 D Perforation Diameter 1.5+0.1 D1 Cavity Hole Diameter 1.5+0.1 P0 Perforation Pitch 4.0±0.1 P1 Cavity to Perforation(Length Direction) 2.0±0.1 A0 Cavity Length 4.8±0.1 B0 Cavity Width 4.5±0.1 K0 Cavity Depth 1.8±0.1 t Carrier Tape Thickness 0.300±0.013 C Cover Tape Width 9.3±0.1 |
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