Document Number: 88486

For technical questions within your region, please contact one of the following:

www.vishay.com

Revision: 23-Apr-10

3

MSP3V3

Vishay General Semiconductor

New Product

Fig. 3 - Relative Variation of Leakage Current vs.

Junction Temperature

Fig. 4 - Typical Peak Forward Voltage Drop vs.

Peak Forward Current

Fig. 5 - Typical Junction Capacitance

Fig. 6 - Typical Transient Thermal Impedance

PACKAGE OUTLINE DIMENSIONS in inches (millimeters)

50

60

70

40

30

20

10

0

25

50

75

100

125

150

10

1

0.1

0.01

0.4

0.6

0.8

1.0

1.2

1.4

1.6

T

T

100

200

300

400

500

600

700

800

900

1000

1

02

3

4

Reverse Voltage (V)

1000

100

10

1

0.1

0.01

1

10

100

1000

t - Pulse Duration (s)

0.106 (2.70)

0.091 (2.30)

0.055 (1.40)

0.047 (1.20)

Cathode Band

MicroSMP

0.030 (0.75)

0.022 (0.55)

0.030 (0.75)

0.022 (0.55)

0.059 (1.50)

0.043 (1.10)

0.039 (0.98)

0.031 (0.78)

0.091 (2.30)

0.083 (2.10)

0.020 (0.50)

0.043

(1.10)

0.011 (0.27)

0.005 (0.12)

0.079

(2.00)

0.032

(0.80)

0.032

(0.80)

Mounting Pad Layout

0.029 (0.73)

0.025 (0.63)