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SIP4613B Datasheet(PDF) 4 Page - Vishay Siliconix

Part # SIP4613B
Description  Protected 1-A High-Side Load Switch
PDF  10 Pages
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Manufacturer  VISHAY [Vishay Siliconix]
Direct Link  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

SIP4613B Datasheet(HTML) 4 Page - Vishay Siliconix

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Document Number: 69998
S-82461-Rev. B, 06-Oct-08
Vishay Siliconix
SiP4613A, SiP4613B
DETAILED DESCRIPTION
The SiP4613A, SiP4613B limits load current by sampling the
pass transistor current and passing that through an external
resistor, RSET. The voltage across RSET, VSET, is then
compared with an internal reference voltage, VREF. In the
event that load current surpasses the set limit current, VSET
will exceed VREF causing the pass transistor gate voltage to
increase, thereby reducing the gate to source voltage of the
PMOS switch and regulating its current back down to ILIMIT.
Setting the Current Limit Level
Setting the current limit level on the SiP4613A, SiP4613B
requires some care to ensure the maximum current required
by the load will not trigger the current limit circuitry. The
minimum current limit threshold should be determined by
taking the maximum current required by the load, ILOAD, and
adding
25 % headroom. The SiP4613A, SiP4613B has a
current limit tolerance of 25 %, which is largely a result of
process variations from part to part, and also temperature
and
VIN/VOUT variances. Thus, to ensure that the actual
current limit is never below the desired current limit a 1/0.80
= 1.25 coefficient needs to be added to the calculations.
Knowing the maximum load current required, the value of
RSET is calculated as follows.
RSET = RSET coefficient/ILIMIT
where ILIMIT = (ILOAD x 1.25) x 1.20 and RSET coefficient is
3460 for a 500 mA current limit. For typical RSET coefficient
values
given
a
limit
current
refer
to
the
"Typical
Characteristics" section.
Operation at Current Limit and Thermal Shutdown
In the event that a load higher than ILIMIT is demanded of the
SiP4613A, SiP4613B the load current will stay fixed at the
current limit established by RSET. However, since the
required current is not supplied, the voltage at OUT will drop.
The increase in VIN - VOUT will cause the chip to dissipate
more heat. The power dissipation for the SiP4613A,
SiP4613B can be expressed as
P = ILOAD x (VIN - VOUT)
Once this exceeds the maximum power dissipation of the
package, the die temperature will rise. When the die
temperature exceeds an over-temperature limit of 165 °C,
the SiP4613A, SiP4613B will shut down until it has cooled
down to 145 °C, before starting up again. As can be seen in
the figure below, the SiP4613A, SiP4613B will continue to
cycle on and off until the load is reduced or the part is turned
off (see figure 4 on next page).
The maximum power dissipation in any application is
dependant
on
the
maximum
junction
temperature,
TJ(MAX) = 125 °C, the junction-to-ambient thermal resistance
for the TSC75-6 package,
θ
J-A = 131 °C/W, and the ambient
temperature, TA, which may be formulaically expressed as:
It then follows that assuming an ambient temperature of
70 °C, the maximum power dissipation will be limited to about
419 mW.
There is CL pin designed to indicate the current limit status of
SiP4613. A typical 5 k
Ω resistor is required to connect
between CL pin and IN pin. In the event of the output over
load, the current limit flag pin CL will go low to indicate the
current limit status of the device. Figure 2 shows the voltage
on CL pin go low after output short.
Figure 2
The voltage signal in CL pin is not only used to indicate the
output short circuit status. It is also used to indicate the
thermal protection status of the device. Once the thermal
protection is activated in the severe output short circuit
condition, the voltage signal on the CL pin will run into the
thermal protection cycling. Figure 3 shows the voltage
waveform of CL pin after activation of the thermal protection
circuit due to the severe short circuit status of the device’s
output.
Figure 3
The thermal protection is the final protection to the device.
The device will be completely shut down including the open
drain current limit indicator pin CL until the device
temperature drop below 145 °C.
131
125
(max)
(max)
A
A
J
A
J
T
T
T
P
-
=
-
=
-
θ
VOUT (500 mV/div)
CL (500 mV/div)
VOUT = 2.4 V
RSET = 6.81 kΩ
50 µs/div
VOUT (2 V/div)
CL (2 V/div)
VOUT = 5.5 V
RSET = 6.81 kΩ
20 ms/div



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