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LPC4310 Datasheet(PDF) 103 Page - NXP Semiconductors

Part # LPC4310
Description  32-bit ARM Cortex-M4/M0 MCU; up to 264 kB SRAM; Ethernet; two High-speed USBs; advanced configurable peripherals
PDF  149 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

LPC4310 Datasheet(HTML) 103 Page - NXP Semiconductors

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LPC4350_30_20_10
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Objective data sheet
Rev. 3.1 — 5 January 2012
103 of 149
NXP Semiconductors
LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
11. Dynamic characteristics
11.1 Wake-up times
[1]
Typical ratings are not guaranteed. The values listed are at room temperature (25
C), nominal supply
voltages.
[2]
Tcy(clk) = 1/CCLK with CCLK = CPU clock frequency.
11.2 External clock
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
Typical ratings are not guaranteed. The values listed are at room temperature (25
C), nominal supply
voltages.
Table 10.
Dynamic characteristic: Wake-up from Deep-sleep, Power-down, and Deep
power-down modes
Tamb = 40 C to +85 C
Symbol Parameter
Conditions
Min
Typ[1]
Max
Unit
twake
wake-up time from Sleep mode
[2] 3
Tcy(clk)
5
 T
cy(clk)
-ns
from Deep-sleep and
Power-down mode
12
51
-
s
from Deep power-down mode
-
250
-
s
after reset
-
250
-
s
Table 11.
Dynamic characteristic: external clock
Tamb = 40 C to +85 C; VDD(IO) over specified ranges.[1]
Symbol Parameter
Conditions
Min
Typ[2] Max
Unit
fosc
oscillator frequency
1
-
25
MHz
Tcy(clk)
clock cycle time
40
-
1000
ns
tCHCX
clock HIGH time
Tcy(clk)  0.4
-
Tcy(clk)  0.6
ns
tCLCX
clock LOW time
Tcy(clk)  0.4
-
Tcy(clk)  0.6
ns
Fig 22. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV)
tCLCX
tCHCX
Tcy(clk)
002aag698



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