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LIS35DE Datasheet(PDF) 37 Page - STMicroelectronics |
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LIS35DE Datasheet(HTML) 37 Page - STMicroelectronics |
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37 / 39 page ![]() LIS35DE Package information Doc ID 15594 Rev 1 37/39 8 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Figure 12. LGA14: mechanical data and package dimensions OUTLINE AND MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A1 0.920 1.000 0.0362 0.0394 A2 0.700 0.0275 A3 0.180 0.220 0.260 0.0071 0.0087 0.0102 D1 2.850 3.000 3.150 0.1122 0.1181 0.1240 E1 4.850 5.000 5.150 0.1909 0.1968 0.2027 e 0.800 0.0315 d 0.300 0.0118 L1 4.000 0.1575 N 1.360 0.0535 N1 1.200 0.0472 P1 0.965 0.975 0.985 0.0380 0.0384 0.0386 P2 0.640 0.650 0.660 0.0252 0.0256 0.0260 T1 0.750 0.800 0.850 0.0295 0.0315 0.0335 T2 0.450 0.500 0.550 0.0177 0.0197 0.0217 R 1.200 1.600 0.0472 0.0630 h 0.150 0.0059 k 0.050 0.0020 i 0.100 0.0039 s 0.100 0.0039 LGA14 (3x5x0.92mm) Pitch 0.8mm Land Grid Array Package 7773587 C |
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