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MIC2168 Datasheet(PDF) 3 Page - Micrel Semiconductor

Part # MIC2168
Description  1MHz PWM Synchronous Buck Control IC
PDF  14 Pages
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Manufacturer  MICREL [Micrel Semiconductor]
Direct Link  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

MIC2168 Datasheet(HTML) 3 Page - Micrel Semiconductor

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April 2005
3
M9999-040805
MIC2168
Micrel, Inc.
Absolute Maximum Ratings(1)
Supply Voltage (VIN)...................................................15.5V
Booststrapped Voltage (VBST).................................VIN +5V
Junction Temperature (TJ)...................–40°C ≤ TJ ≤+125°C
Storage Temperature (TS) ........................ –65°C to +150°C
Operating Ratings(2)
Supply Voltage (VIN)..................................... +3V to +14.5V
Output Voltage Range ..........................0.8V to VIN × DMAX
Package Thermal Resistance
θJA 10-lead MSOP.............................................180°C/W
Electrical Characteristics(3)
TJ = 25°C, VIN = 5V, unless otherwise specified. Bold values indicate –40°C < TJ < +125°C
Parameter
Condition
Min
Typ
Max
Units
Feedback Voltage Reference
(± 1%)
0.792
0.8
0.808
V
Feedback Voltage Reference
(± 2% over temp)
0.784
0.8
0.816
V
Feedback Bias Current
30
100
nA
Output Voltage Line Regulation
0.03
% / V
Output Voltage Load Regulation
0.5
%
Output Voltage Total Regulation
3V ≤ VIN ≤ 14.5V; 1A ≤ IOUT ≤ 10A; (VOUT = 2.5V)(4)
0.6
%
Oscillator Section
Oscillator Frequency
900
1000
1100
kHz
Maximum Duty Cycle
90
%
Minimum On-Time(4)
30
60
ns
Input and VDD Supply
PWM Mode Supply Current
VCS = VIN –0.25V; VFB = 0.7V (output switching but excluding
1.6
3
mA
external MOSFET gate current.)
Shutdown Quiescent Current
VCOMP/EN = 0V
50
150
µ
A
VCOMP Shutdown Threshold
0.1
0.25
0.4
V
VCOMP Shutdown Blanking
CCOMP = 100nF
4
ms
Period
Digital Supply Voltage (VDD)
VIN ≥ 6V
4.7
5
5.3
V
Notes:
1. Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating
the device outside of its operating ratings. The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(max),
the junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA. The maximum allowable power dissipation will result in excessive
die temperature, and the regulator will go into thermal shutdown.
2. Devices are ESD sensitive, handling precautions required.
3. Specification for packaged product only.
4. Guaranteed by design.



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