AD9633 datasheet(11/40 Pages) AD

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Data Sheet

AD9633

Rev. 0 | Page 11 of 40

ABSOLUTE MAXIMUM RATINGS

THERMAL RESISTANCE

Table 6.

Parameter

Rating

Electrical

AVDD to AGND

−0.3 V to +2.0 V

DRVDD to AGND

−0.3 V to +2.0 V

Digital Outputs (D0±x, D1±x, DCO+,

DCO−, FCO+, FCO−) to AGND

−0.3 V to +2.0 V

CLK+, CLK− to AGND

−0.3 V to +2.0 V

VIN+x, VIN−x to AGND

−0.3 V to +2.0 V

SCLK/DTP, SDIO/OLM, CSB to AGND

−0.3 V to +2.0 V

SYNC, PDWN to AGND

−0.3 V to +2.0 V

RBIAS to AGND

−0.3 V to +2.0 V

VREF, SENSE to AGND

−0.3 V to +2.0 V

Environmental

Operating Temperature Range (Ambient)

−40°C to +85°C

Maximum Junction Temperature

150°C

Lead Temperature (Soldering, 10 sec)

300°C

Storage Temperature Range (Ambient)

−65°C to +150°C

Table 7. Thermal Resistance

Package Type

Air Flow

Velocity

(m/sec)

θJA1

θJB

θJC

Unit

48-Lead LFCSP

0.0

23.7

7.8

7.1

°C/W

7 mm × 7 mm

1.0

20.0

N/A

°C/W

CP-48-13

2.5

18.7

N/A

°C/W

1 θJA for a 4-layer PCB with solid ground plane (simulated). Exposed pad

soldered to PCB.

ESD CAUTION

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

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