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OPA656 Datasheet(PDF) 2 Page - Texas Instruments |
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OPA656 Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 4 page ![]() OPA656-DIE SBOS596 – MARCH 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. BARE DIE INFORMATION BACKSIDE BOND PAD BOND PAD DIE THICKNESS BACKSIDE FINISH POTENTIAL METALLIZATION COMPOSITION THICKNESS 15 mils. Silicon with backgrind VS- TiW/AlCu (0.5%) 1100 nm Table 1. Bond Pad Coordinates in Microns(1) DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX Inverting Input 1 27 623 127 723 NonInverting Input 2 27 53 127 153 N/C 3 181 53 281 153 Output 4 723 27 823 127 VS- 5 723 337 823 439 VS+ 6 723 649 823 749 N/C 7 181 623 281 723 (1) Substrate is VS-. 2 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): OPA656-DIE |
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