TLV62080

1mH

10µF

2.5V .. 5.5V

65.3k

39.2k

V

IN

POWER GOOD

SW

VOS

VIN

EN

GND

GND

PG

FB

22µF

180k

V

OUT

1.2V

TLV62080

www.ti.com

SLVSAK9A

– OCTOBER 2011 – REVISED NOVEMBER 2011

Figure 18. PCB Layout Suggestion

THERMAL INFORMATION

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires

special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added

heat sinks and convection surfaces, and the presence of other heat-generating components affect the

power-dissipation limits of a given component.

Three basic approaches for enhancing thermal performance are listed below:

•

Improving the power dissipation capability of the PCB design

•

Improving the thermal coupling of the component to the PCB by soldering the ThermalPAD

™

•

Introducing airflow in the system

For more details on how to use the thermal parameters, see the application notes: Thermal Characteristics

Application Notes SZZA017 and SPRA953.

APPLICATION EXAMPLES

Figure 19. 1.2V Output Voltage Application

Copyright

© 2011, Texas Instruments Incorporated

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