LTM2881

23

2881fe

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

REVISION HISTORY

REV

DATE

DESCRIPTION

PAGE NUMBER

A

3/10

Changes to Features, Description and Typical Application

Add BGA Package to Pin Configuration, Order Information and Package Description Sections

Changes to LGA Package in Pin Configuration Section

Changes to Electrical Characteristics Section

Changes to Graphs G09, G13, G14

Update to Pin Functions

Update to Applications Information

Change to X-Axis on Figures 9a and 9b

Update to Supply Current Section

“PCB Layout Isolation Considerations” Section Replaced

RF, Magnetic Field Immunity Section Added

Changes to Related Parts

1

2, 19

2

3

6, 7

8

12

13

14

15

16

22

B

8/10

H-Grade parts added. Reflected throughout the data sheet.

1-22

C

5/11

HV-Grade parts removed. Reflected throughout the data sheet.

Updated the PCB Layout section.

Updated the Related Parts.

1-24

15, 16, 17

24

D

1/12

HV and MPY parts added. Reflected throughout the data sheet.

1-24

E

4/12

Corrected Figure 15

3

15