ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.

These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave

soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming

Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

AP02001 Rev. 52

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Suggested Pad Layout

© Diodes Incorporated

U-DFN4030-12

Dimensions

Value

(in mm)

C

0.500

X

0.300

X1

2.800

X2

3.350

Y

0.600

Y1

1.750

Y2

3.400

U-DFN4030-12 Type B

Dimensions

Value

(in mm)

C

0.500

X

0.350

X1

1.160

X2

0.900

X3

1.720

X4

0.850

X5

3.700

Y

0.700

Y1

0.870

Y2

0.500

Y3

0.550

Y4

0.350

Y5

1.710

Y6

0.940

Y7

3.300

Pin1

C

X (12x)

Y1

Y2

Y (12x)

X2

X1

Y7

X5

C

X (12X)

Y5 (2x)

X1(2x)

X3 (2x)

Y

Y3

X2

Y6

Y2

Y4

X4

1

Y1