SW63-2G datasheet(26/116 Pages) AAVID

26 / 116 page

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FIGURE A

SMT Footprints

10.67

(0.420)

15.49

(0.610)

10.41

(0.410)

2.29

(0.090)

7.62

(0.300)

15.49

(0.610)

1.40

(0.060)

0.80

(0.030)

FIGURE B

FIGURE D

FIGURE C

16.76

(0.660)

2.54

(0.100)

10.67

(0.420)

20.32

(0.800)

2.54

(0.100)

Recommended copper heat speader drain pad footprint

Recommended heat sink solder mask opening

Note: The thickness of

the drain pad is variable

depending on the amount

of heat generated by the

SMT device, design limita-

tions and process.

Part Number

“L”

“W”

573100

9.53 (0.375)

13.97 (0.550)

573300

14.22 (0.560)

16.26 (0.640)

573400

14.22 (0.560)

21.08 (0.830)

Part Number

“L”

“W1”

“W2”

573100

9.02 (0.355)

13.46 (0.530)

8.89 (0.350)

573300

13.72 (0.540)

15.75 (0.620)

11.18 (0.440)

573400

13.72 (0.540)

20.57 (0.810)

16.00 (0.630)

Recommended copper pad size

for heat sink and device mounting footprint

For D Pak (TO-263)

For MO-184 and SO-10

Recommended copper pad size

for heat sink and device mounting footprint

SW63-2G Datasheet(PDF) 26 Page - Aavid, Thermal Division of Boyd Corporation

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