List of Figures

1-1

RFID System With Reader, Antenna, and Tag-it HF-I Transponder

.................................................. 8

1-2

Memory Organization of the Tag-it HF-I Pro Transponder IC

......................................................... 9

2-1

Wafer on FFC

............................................................................................................... 13

2-2

Antenna and Test Pad Location

.......................................................................................... 14

2-3

Cross Section of Bump

.................................................................................................... 15

3-1

Position of Wafer Identification Code

.................................................................................... 18

3-2

Wafer Identification Code 1

............................................................................................... 19

3-3

Wafer Identification Code 2

............................................................................................... 19

3-4

Ink Dot Drawing

............................................................................................................ 21

3-5

Packing of Wafers

.......................................................................................................... 22

3-6

Packing of Sawn Wafers (Multi)

.......................................................................................... 23

3-7

Packing of Sawn Wafers (Single)

........................................................................................ 23

3-8

Barcode Label

.............................................................................................................. 24

3-9

Recommended Operating Range – Impedance vs Antenna Q

...................................................... 25

List of Tables

1-1

Command Set for Tag-it HF-I Pro Transponder IC

.................................................................... 10

1-2

Part Numbers

............................................................................................................... 10

2-1

Absolute Maximum Ratings

............................................................................................... 12

2-2

Recommended Operating Conditions

................................................................................... 12

2-3

Electrical Characteristics

................................................................................................. 12

2-4

General Mechanical Wafer Specification

................................................................................ 12

2-5

Mechanical Wafer Specification After Grinding, Sawing on FFC

.................................................... 13

2-6

Mechanical Die Specification

............................................................................................. 14

2-7

Antenna and Test Pad Location

.......................................................................................... 14

2-8

Bump Specification

......................................................................................................... 15

3-1

Ink Dot Specification

....................................................................................................... 20

3-2

Ink Dot Placement

.......................................................................................................... 21

3-3

Storage Conditions

......................................................................................................... 24

3-4

Antenna System Parameters

............................................................................................. 25

4

List of Figures

SCBU045 (11-09-21-065) – October 2007

Submit Documentation Feedback