12/21

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NOTE ON USE (Continued)

the power loss of micro DC/DC according to the following formula:

EFFI: Conversion Efficiency (%)

Measurement Condition (Reference data)

Condition: Mount on a board

Ambient: Natural convection

Soldering: Lead (Pb) free

Board: Dimensions 40 x 40 mm (1600 mm

Copper (Cu) traces occupy 50% of the board area

In top and back faces

Package heat-sink is tied to the copper traces

Material: Glass Epoxy (FR-4)

Thickness: 1.6mm

Through-hole: 4 x 0.8 Diameter

15. High step-down ratio and very light load may lead an intermittent oscillation when PWM mode.

16. When PWM/PFM automatic switching goes into continuous mode, the IC may be in unstable operation for the range of MAXDUTY area

with small input/output differential.

17. Please use within the power dissipation range below. Please also note that the power dissipation may changed by test conditions, the

power dissipation figure shown is PCB mounted.

0.0

0.2

0.4

0.6

0.8

1.0

1.2

0

25

50

75

100

Operating Temperature　Ta (℃)

Evaluation Board (unit: mm)

.

.

40.0

28.9

2.54

1.4