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TMS37126 Datasheet(PDF) 2 Page - Texas Instruments

Part # TMS37126
Description  REMOTE ACCESS IDENTIFICATION DEVICEWITH INTEGRATED 3D WAKEUP RECEIVER AND IMMOBILIZER INTERFACE
PDF  10 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TMS37126 Datasheet(HTML) 2 Page - Texas Instruments

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DBT PACKAGE
(TOP VIEW)
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TDAT
TEN
RF2
NPOR
RF3
VCC_CU
WDEEN
VBAT
VBATI
NC
TCLK
RF1
VCL
AM_MOD
GND
RSSI
WAKE
BUSY
CLKA/M
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NC
NC
NC
MOD
TX
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NC
NC
SPI_SIMO
SPI_SOMI
SPI_CLK
EOBA
TMS37126
SCBS880 – MAY 2012
www.ti.com
The embedded DST80 immobilizer interface offers a high level of security through its hardware encryption
coprocessor and can also handle mutual authentication schemes. It operates without a battery and can be
accessed in terms of its memory and encryption through the SPI interface. Power management features include
battery charge and check as well as a battery backup function, which allows operation of all functions with low or
even no battery as long as there is sufficient energy from the LF field.
The Passive Entry (PE) device manages the immobilizer communication and LF wake reception. The special
high-Q design achieves communication ranges up to 3 m for the PE link with outstanding low standby current on
the receiver side. The front end offers flexible configuration of two different wake patterns of 0, 4, 8 or 16 bit
length. Each channel can be adjusted in sensitivity and resonance frequency, which results in reproducible
system designs. Security keys and rolling codes can be stored in the integrated EEPROM memory. This memory
is accessible over the LF interface without support from the battery in the key fob and over the SPI interface. The
PE device offers a special battery backup mode to operate the microcontroller without battery support. The
external resonant circuit with an LF coil and a resonant capacitor can be trimmed to the correct resonant
frequency with the integrated trimming capability, eliminating part tolerances.
Ordering Information(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
-40°C to 85°C
TSSOP – DBT
TMS37126D3XDBTRG4
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2)
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
2
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Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TMS37126



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