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TMS37126 Datasheet(PDF) 2 Page - Texas Instruments |
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TMS37126 Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 10 page ![]() DBT PACKAGE (TOP VIEW) 1 2 3 4 5 6 7 8 9 10 21 22 23 24 25 26 27 28 29 30 TDAT TEN RF2 NPOR RF3 VCC_CU WDEEN VBAT VBATI NC TCLK RF1 VCL AM_MOD GND RSSI WAKE BUSY CLKA/M 11 12 13 14 15 NC NC NC MOD TX 16 17 18 19 20 NC NC SPI_SIMO SPI_SOMI SPI_CLK EOBA TMS37126 SCBS880 – MAY 2012 www.ti.com The embedded DST80 immobilizer interface offers a high level of security through its hardware encryption coprocessor and can also handle mutual authentication schemes. It operates without a battery and can be accessed in terms of its memory and encryption through the SPI interface. Power management features include battery charge and check as well as a battery backup function, which allows operation of all functions with low or even no battery as long as there is sufficient energy from the LF field. The Passive Entry (PE) device manages the immobilizer communication and LF wake reception. The special high-Q design achieves communication ranges up to 3 m for the PE link with outstanding low standby current on the receiver side. The front end offers flexible configuration of two different wake patterns of 0, 4, 8 or 16 bit length. Each channel can be adjusted in sensitivity and resonance frequency, which results in reproducible system designs. Security keys and rolling codes can be stored in the integrated EEPROM memory. This memory is accessible over the LF interface without support from the battery in the key fob and over the SPI interface. The PE device offers a special battery backup mode to operate the microcontroller without battery support. The external resonant circuit with an LF coil and a resonant capacitor can be trimmed to the correct resonant frequency with the integrated trimming capability, eliminating part tolerances. Ordering Information(1) TA PACKAGE(2) ORDERABLE PART NUMBER -40°C to 85°C TSSOP – DBT TMS37126D3XDBTRG4 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. (2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. 2 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TMS37126 |
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