SST31LF021 datasheet(7/24 Pages) SST

7 / 24 page

Data Sheet

2 Mbit Flash + 1 Mbit SRAM ComboMemory

SST31LF021 / SST31LF021E

S71137-03-000

10/01 392

TABLE

4: SOFTWARE COMMAND SEQUENCE

Command

Sequence

1st Bus

Write Cycle

2nd Bus

Write Cycle

3rd Bus

Write Cycle

4th Bus

Write Cycle

5th Bus

Write Cycle

6th Bus

Write Cycle

Addr1

Data

Addr1

Data

Addr1

Data

Addr1

Data

Addr1

Data

Addr1

Data

Byte-Program

5555H

AAH

2AAAH

55H

5555H

A0H

BA2

Data

Sector-Erase

5555H

AAH

2AAAH

55H

5555H

80H

5555H

AAH

2AAAH

55H

SAX3

30H

Bank-Erase

5555H

AAH

2AAAH

55H

5555H

80H

5555H

AAH

2AAAH

55H

5555H

10H

Software ID Entry4,5

5555H

AAH

2AAAH

55H

5555H

90H

Software ID Exit

5555H

AAH

2AAAH

55H

5555H

F0H

T4.4 392

1. Address format A14-A0 (Hex),Address A15, A16, and A17 can be VIL or VIH, but no other value, for the Command sequence.

2. BA = Program Byte address

3. SAX for Sector-Erase; uses A17-A12 address lines

4. The device does not remain in Software Product ID mode if powered down.

5. With A17-A1 = 0; SST Manufacturer’s ID = BFH, is read with A0 = 0,

SST31LF021 Device ID = 18H, is read with A0 = 1,

SST31LF021E Device ID = 19H, is read with A0 = 1

Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum

Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation

of the device at these conditions or conditions greater than those defined in the operational sections of this data

sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)

Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -20°C to +85°C

Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C

D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDD+0.5V

Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to VDD+1.0V

Package Power Dissipation Capability (Ta = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W

Surface Mount Lead Soldering Temperature (3 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240°C

Output Short Circuit Current1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA

1. Outputs shorted for no more than one second. No more than one output shorted at a time.

OPERATING RANGE: SST31LF021/021E

Range

Ambient Temp

VDD

Commercial

0°C to +70°C

3.0-3.6V

Extended

-20°C to +85°C

3.0-3.6V

AC CONDITIONS OF TEST

Input Rise/Fall Time . . . . . . . . . . . . . . . 5 ns

Output Load . . . . . . . . . . . . . . . . . . . . . CL = 30 pF

See Figures 14 and 15

SST31LF021 Datasheet(PDF) 7 Page - Silicon Storage Technology, Inc

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